KIT33996EKEVB Freescale Semiconductor, KIT33996EKEVB Datasheet - Page 4

• Manufacturer Part Number: KIT33996EKEVB
• Description: KIT EVAL 33996 16OUTPUT SW W/SPI
• Manufacturer: Freescale Semiconductor

Specifications of KIT33996EKEVB

• Main Purpose: Power Management, Low Side Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33996
• Primary Attributes: 16 Outputs, 5 ~ 27V, 0.9 ~ 2.5A, SPI Interface, PWM Interface
• Secondary Attributes: 0.55 Ohm RdsON, Temperature, Over Voltage, Short Circuit Protection
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4
33996
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
VPWR Supply Voltage
SO Output Driver Power Supply Voltage
SPI Interface Logic Input Voltage (
Output Drain Voltage
Frequency of SPI Operation
Output Clamp Energy
ESD Voltage
Operating Temperature
Storage Temperature
Power Dissipation (T
Peak Package Reflow Temperature During Reflow
Thermal Resistance
1.
2.
3.
4.
5.
6.
7.
8.
9.
All voltages are with respect to ground unless otherwise noted.
Human Body Model
Machine Model
Ambient
Junction
Case
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
Exceeding these limits may cause malfunction or permanent damage to the device.
This parameter is guaranteed by design but not production tested.
Maximum output clamp energy capability at 150°C junction temperature using single nonrepetitive pulse method.
ESD data available upon request. ESD testing is performed in accordance with the Human Body Model (C
and the Machine Model (C
Maximum power dissipation with no heat sink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Tested per JEDEC test JESD52-2 (single-layer PWB).
Tested per JEDEC test JESD51-8 (two-layer PWB).
(4)
A
(9)
(3)
= 25°C)
(1)
(8)
(2)
(5)
ZAP
CS
Rating
= 200pF, R
, PWM, SI, SO, SCLK,
(1)
ELECTRICAL CHARACTERISTICS
ZAP
(6)
= 0Ω).
,
(7)
MAXIMUM RATINGS
RST
)
(1)
Symbol
E
SO
V
V
T
V
T
R
R
CLAMP
R
f
PPRT
V
ESD1
ESD2
V
P
PWR
T
T
STG
SPI
T
θ
θ
θ
PWR
IN
C
D
A
D
J
JA
JL
JC
Analog Integrated Circuit Device Data
-0.3 to 7.0
-0.3 to 7.0
-40 to 125
-40 to 150
-40 to 125
-55 to 150
-1.5 to 50
-0.3 to 45
±2000
Note 7
Value
±200
6.0
8.0
1.2
50
1.7
75
ZAP
Freescale Semiconductor
= 100pF, R
ZAP
°C/W
= 1500Ω)
MHz
Unit
mJ
°
°
°C
V
V
V
V
V
W
C
C