DS2148DK Maxim Integrated Products, DS2148DK Datasheet - Page 60

• Manufacturer Part Number: DS2148DK
• Description: KIT DESIGN LIU DS2148 3/5V T1/E1
• Manufacturer: Maxim Integrated Products

Specifications of DS2148DK

• Main Purpose: Telecom, Line Interface Units (LIUs)
• Utilized Ic / Part: DS2148
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

9.1 THERMAL CHARACTERISTICS
Table 9-4. Thermal Characteristics—DS21Q48 CSBGA Package
Ambient Temperature
Junction Temperature
Theta-JA (θ
Theta-JC (θ
NOTES:
1) The package is mounted on a four-layer JEDEC-standard test board.
2) Theta-JA (θ
3) While Theta-JC (θ
Table 9-5. Theta-JA (θ
FORCED AIR (m/s)
layer JEDEC-standard test board.
junction temperature (T
packages (T
The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document
EIA-JESD51-2.
PARAMETER
2.5
0
1
JC
JA
) in Still Air
) in Still Air
JA
C
), the proper term is Psi-JT. It is defined by:
) is the junction to ambient thermal resistance, when the package is mounted on a four-
JC
) is commonly used as the thermal parameter that provides a correlation between the
j
THETA-JA (θ
) and the average temperature on top center of four of the chip-scale BGA
(T
JA
J
) vs. Airflow
24ºC/W
21ºC/W
19ºC/W
- T
C
-40ºC
MIN
) / overall package power
-
-
-
JA
)
+4.1ºC/W
+24ºC/W
60 of 73
TYP
-
-
+125ºC
+85ºC
MAX
-
-
NOTES
1
2
3