AD9245BCP-20EBZ Analog Devices Inc, AD9245BCP-20EBZ Datasheet - Page 29
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AD9245BCP-20EBZ
Manufacturer Part Number
AD9245BCP-20EBZ
Description
BOARD EVAL FOR AD9245BCP-20
Manufacturer
Analog Devices Inc
Datasheet
1.AD9245BCPZ-80.pdf
(32 pages)
Specifications of AD9245BCP-20EBZ
Number Of Adc's
1
Number Of Bits
14
Sampling Rate (per Second)
20M
Data Interface
Parallel
Inputs Per Adc
1 Differential
Input Range
2 Vpp
Power (typ) @ Conditions
95mW @ 20MSPS
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9245BCP-20
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9245BCP-80
AD9245BCPRL7–80
AD9245BCPZ-80
AD9245BCPZRL7-80
AD9245BCPZ-65
AD9245BCPZRL7-65
AD9245BCPZ-40
AD9245BCPZRL7-40
AD9245BCPZ-20
AD9245BCPZRL7-20
AD9245BCP-80EB
AD9245BCP-65EB
AD9245BCP-40EB
AD9245BCP-20EB
1
2
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the
maximum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
Z = Pb-free part.
2
2
2
2
2
2
2
2
INDICATOR
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
BSC SQ
VIEW
TOP
5.00
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
BSC SQ
4.75
0.20 REF
Rev. D | Page 29 of 32
0.05 MAX
0.02 NOM
(CP-32-2)
0.60 MAX
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.08
1
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
EXPOSED
PAD
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
AD9245