MCP1650DM-DDSC1 Microchip Technology, MCP1650DM-DDSC1 Datasheet - Page 21

• Manufacturer Part Number: MCP1650DM-DDSC1
• Description: BOARD DEMO FOR MCP1650 SEPIC
• Manufacturer: Microchip Technology
• Type: DC/DC Switching Converters, Regulators & Controllersr

Specifications of MCP1650DM-DDSC1

• Main Purpose: DC/DC, Step Up or Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 5V
• Current - Output: 160mA
• Voltage - Input: 3 ~ 7V
• Regulator Topology: Boost
• Frequency - Switching: 750kHz
• Board Type: Fully Populated
• Utilized Ic / Part: MCP1650
• Input Voltage: 3 V to 7 V
• Output Voltage: 5 V
• Product: Power Management Modules
• For Use With/related Products: MCP1650R-E/MS
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 6-2 represents the top wiring for the MCP1650/
51/52/53 application shown.
As shown in Figure 6-2, the high-current wiring is short
and wide. In this example, a 1 oz. copper layer is used
for both the top and bottom layers. The ground plane
connected to C2 and R4 are connected through the
vias (holes) connecting the top and bottom layer. The
feedback signal (from TP2) is wired from the output of
the regulator around the high current switching section
to the feedback voltage divider and to the FB pin of the
MCP1650/51/52/53.
FIGURE 6-2:
2004 Microchip Technology Inc.
Top Layer Wiring.
Figure 6-3 represents the bottom wiring for the
MCP1650/51/52/53 application shown.
Silk-screen reference designator labels are transparent
from the top of the board. The analog ground plane and
power ground plane are connected near the ground
connection of the input capacitor (C
high-power, ground-circulating currents from flowing
through the analog ground plane.
FIGURE 6-3:
MCP1650/51/52/53
Bottom Layer Wiring.
DS21876A-page 21
2
). This prevents