MCP1256/7/8/9EV Microchip Technology, MCP1256/7/8/9EV Datasheet - Page 17
![BOARD EVAL FOR MCP1256/7/8/9](/photos/9/14/91413/mcp1256_7_8_9ev_sml.jpg)
MCP1256/7/8/9EV
Manufacturer Part Number
MCP1256/7/8/9EV
Description
BOARD EVAL FOR MCP1256/7/8/9
Manufacturer
Microchip Technology
Specifications of MCP1256/7/8/9EV
Main Purpose
DC/DC, Step Up
Outputs And Type
1, Non-Isolated
Voltage - Output
3.3V
Current - Output
100mA
Voltage - Input
1.6 ~ 3.6V
Regulator Topology
Buck-Boost
Frequency - Switching
650kHz
Board Type
Fully Populated
Utilized Ic / Part
MCP1256, MCP1257, MCP1258, MCP1259
Processor To Be Evaluated
MCP1256/7/8/9
Lead Free Status / RoHS Status
Not applicable / Not applicable
Power - Output
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
© 2006 Microchip Technology Inc.
B
c
REF: Reference Dime n sion, usually witho ut tolerance, for information purposes only.
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MO-187 BA
Drawing No. C04-021
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bott om
p
See ASME Y14.5M
See ASME Y14.5M
n
Dimension Limits
E1
E
Units
A2
E1
A1
p
E
D
L
F
B
n
A
c
MIN
(F)
.030
.000
.016
.003
.006
L
0°
5°
5°
2
1
.020 BSC
.193 BSC
.118 BSC
.118 BSC
.037 REF
INCHES
NOM
D
.033
.024
.009
10
–
–
–
–
MAX
A1
A
.043
.037
.006
.031
.009
.012
15°
15°
8°
MCP1256/7/8/9
MIN
0.75
0.00
0.40
0.08
0.15
0°
5°
5°
MILLIMETERS*
–
0.50 BSC
4.90 BSC
3.00 BSC
3.00 BSC
Revised 09-16-05
0.95 REF
NOM
0.85
0.60
0.23
10
–
–
–
–
–
DS21989A-page 17
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
A2
8°