IRDC3629A International Rectifier, IRDC3629A Datasheet - Page 21

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IRDC3629A

Manufacturer Part Number
IRDC3629A
Description
BOARD EVAL SYNC BUCK CONTROLLER
Manufacturer
International Rectifier
Datasheets
11/29/2007
Stencil Design
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
lead land.
much solder is deposited on the center pad the part will float and the lead lands will be open.
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
The stencil lead land apertures should therefore be shortened in length by 80% and centered on the
The land pad aperture should deposit approximately 50% area of solder on the center pad. If too
The maximum length and width of the land pad stencil aperture should be equal to the solder resist
IR3629/IR3629A MPbF
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