IRDC3831 International Rectifier, IRDC3831 Datasheet

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IRDC3831

Manufacturer Part Number
IRDC3831
Description
BOARD EVAL SYNC BUCK CONVERTER
Manufacturer
International Rectifier
Datasheets
DESCRIPTION
The
converter,
performance and flexible solution in a small
5mmx6mm Power QFN package.
Key features offered by the IR3831 include
programmable soft-start ramp, Power Good
thermal protection, programmable switching
frequency, tracking input, enable input, input
under-voltage lockout for proper start-up,
and pre-bias start-up.
• V
• F
BOARD FEATURES
SupIRBuck
02/10/09
V
V
L = 0.68uH
C
C
in
out
s
in
out
cc
IR3831
= 400kHz
= 3x10uF (ceramic 1206) + 330uF (electrolytic)
= +12V (13.2V Max)
= +5V (5.5V Max)
= 8x22uF (ceramic 0805)
= +0.75V @ 0- ±8A
USER GUIDE FOR IR3831 EVALUATION BOARD
providing
is
a
synchronous
a
TM
compact,
buck
high
,
An output over-current protection function is
implemented by sensing the voltage developed
across the on-resistance of the synchronous
rectifier
performance.
This user guide contains the schematic and bill
of materials for the IR3831 evaluation board.
The guide describes operation and use of the
evaluation board itself. Detailed
information for IR3831 is available in the
IR3831 data sheet.
MOSFET
for
optimum
IRDC3831
application
cost
and
1

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IRDC3831 Summary of contents

Page 1

... MOSFET performance. This user guide contains the schematic and bill , of materials for the IR3831 evaluation board. The guide describes operation and use of the evaluation board itself. Detailed information for IR3831 is available in the IR3831 data sheet. IRDC3831 for optimum cost and application 1 ...

Page 2

... For proper operation of IR3831, the voltage at Vp pin Table I. Connections Signal Name V (+12V) in Ground Vcc input Ground for Vcc input Ground of V out V (+0.75V) out Enable Tracking Input DDQ Power Good Signal IRDC3831 2 ...

Page 3

... Connection Diagram Enable Vp VDDQ AGND PGood SS Fig. 1: Connection diagram of IR383x evaluation boards 02/10/09 Vin GND Vcc GND IRDC3831 GND Vo 3 ...

Page 4

... Fig. 2: Board layout, top overlay Fig. 3: Board layout, bottom overlay IRDC3831 4 ...

Page 5

... AGND Plane Single point connection between AGND and PGND. 02/10/09 Fig. 4: Board layout, mid-layer I Fig. 5: Board layout, mid-layer II IRDC3831 PGND Plane 5 ...

Page 6

... AGnd3 15 Boot Vcc 13 9 Enable PGood IRDC3831 ...

Page 7

... Thick Film, 0603,1/10W,1% 0 Thick Film, 0603,1/10W,1% 1.48k Thick Film, 0603,1/10W,1% 6.65k Thick Film, 0603,1/10W,1% 1.50k Thick Film, 0603,1/10W,1% IR3831 8A SupIRBuck R7E, 6mmx5mm IRDC3831 Manufacturer Part Number Panasonic EEV-FK1E331P Panasonic - ECG ECJ-3YB1C106M Panasonic- ECG ECJ-1VB1C223K Panasonic - ECG ECJ-GVB1A106M Panasonic - ECG ECJ-1VB1E104K ...

Page 8

... :SS out 2 DDQ 3 Fig. 9: Inductor node at 8A, sourcing current, Ch :SW Fig. 11: Output Voltage Ripple, 8A, sourcing current 02/10/09 :PGood 4 out out IRDC3831 Fig. 8: Start up with Prebias, 0A Load :SS 1 out 2 DDQ, 3 Fig. 10: Inductor node at -3A, sinking current out Fig. 12: Short (Hiccup) Recovery :PGood ...

Page 9

... TYPICAL OPERATING WAVEFORMS Vin=12V, Vcc=5V, Vo=0.75V, Room Temperature, No Air Flow Fig. 13: Tracking 8A, sourcing current :PGood 1 out 3 DDQ 4 Fig. 15: Transient Response, 1A/us -0.5A to +0.5A load , out 02/10/09 Fig. 14: Tracking -3A load, sinking current IRDC3831 : :PGood 1 out DDQ 4 9 ...

Page 10

... TYPICAL OPERATING WAVEFORMS Vin=12V, Vcc=5V, Vo=0.75V, Io=+8A, Room Temperature, No Air Flow Fig.16: Bode Plot at 8A load (sourcing current) shows a bandwidth of 43kHz and phase margin of 63 degrees 02/10/09 IRDC3831 10 ...

Page 11

... TYPICAL OPERATING WAVEFORMS Vin=12V, Vo=0.75V, Io=0- +8A, Room Temperature, No Air Flow 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 02/10/ Load Percentage (%) Fig.17: Efficiency versus load current Load Percentage(%) Fig.18: Power loss versus load current IRDC3831 100 100 11 ...

Page 12

... THERMAL IMAGES Vin=12V, Vo=0.75V, Io=+8A, Room Temperature, No Air Flow Test Point 1: IR3831, Test Point 2: Inductor 02/10/09 Fig.19: Thermal Image at 8A load IRDC3831 12 ...

Page 13

... The pad lands (the 4 big pads other than the 11 IC pins) length and width should be equal to maximum part pad length and width. However, the minimum metal to metal spacing should be no less than 0.17mm for 2 oz. Copper; no less than 0.1mm for 1 oz. Copper and no less than 0.23mm for 3 oz. Copper. 02/10/09 IRDC3831 ...

Page 14

... Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of the solder resist strip separating the lead lands from the pad land. 02/10/09 IRDC3831 ...

Page 15

... The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is pushed into the solder paste. 02/10/09 IRDC3831 ...

Page 16

... This product has been designed and qualified for the Consumer market. 02/10/09 BOTTOM VIEW 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 Visit us at www.irf.com for sales contact information Data and specifications subject to change without notice. 11/07 IRDC3831 TAC Fax: (310) 252-7903 ...

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