MAX5890EVKIT# Maxim Integrated Products, MAX5890EVKIT# Datasheet - Page 2

• Manufacturer Part Number: MAX5890EVKIT#
• Description: KIT EVALUATION FOR MAX5890
• Manufacturer: Maxim Integrated Products

Specifications of MAX5890EVKIT#

• Number Of Dac's: 1
• Number Of Bits: 14
• Outputs And Type: 1, Differential
• Sampling Rate (per Second): 600M
• Data Interface: Parallel
• Settling Time: 11ns
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: MAX5890
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
AV
AV
REFIO, FSADJ to AGND, DACREF,
OUTP, OUTN to AGND, DGND, DACREF,
CLKP, CLKN to AGND, DGND, DACREF,
PD to AGND, DGND, DACREF,
ELECTRICAL CHARACTERISTICS
(AV
ed, transformer-coupled output, I
anteed by production testing. Specifications at T
= +25°C.)
14-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed-paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
Output Leakage Current
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
Minimum DAC Update Rate
Noise Spectral Density
and CGND.......................................................-0.3V to +2.16V
DACREF, and CGND.........................................-0.3V to +3.9V
DGND, and CGND ..........................-0.3V to (AV
and CGND .......................................-1.2V to (AV
and CGND..........................................-0.3V to (AV
and CGND.......................................-0.3V to (DV
DD1.8
DD3.3
DD3.3
_______________________________________________________________________________________
, DV
, DV
= DV
PARAMETER
DD1.8
DD3.3
DD3.3
, AV
to AGND, DGND, DACREF,
= AV
CLK
CLK
to AGND, DGND,
= 3.3V, AV
OUT
SYMBOL
= 20mA, T
C
GE
R
DNL
I
DD1.8
INL
OS
OUT
OUT
OUT
N
FS
= DV
A
A
DD3.3
DD3.3
DD3.3
Measured differentially
Measured differentially
External reference
Internal reference
External reference
Single-ended
PD = high, power-down mode
f
-12dBFS, 20MHz
offset from the
carrier
= -40°C to +85°C, unless otherwise noted. Specifications at T
CLK
< +25°C are guaranteed by design and characterization. Typical values are at T
CLK
DD1.8
= 500MHz,
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
= 1.8V, external reference V
CONDITIONS
Digital Data Inputs (D0N–D13N, D0P–D13P) to AGND,
Continuous Power Dissipation (T
Thermal Resistance
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
f
A
f
A
OUT
OUT
FULL-SCALE
FULL-SCALE
DGND, DACREF, and CGND ..........-0.3V to (DV
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
= 36MHz
= 151MHz
= -3.5dBm
= -6.4dBm
REFIO
θ
JA
= 1.2V, output load 50Ω double-terminat-
(Note 1) ....................................24°C/W
-0.02
MIN
-1.0
600
-4
2
A
= +70°C) (Note 1)
±0.001
±130
±100
±0.5
TYP
-162
-153
±1
±1
14
±1
1
5
1
A
≥ +25°C are guar-
+0.02
MAX
+1.1
+4
20
DD1.8
dBFS/Hz
ppm/°C
UNITS
+ 0.3V)
Msps
Msps
%FS
%FS
LSB
LSB
Bits
MΩ
mA
pF
µA
V
A