MCP6XXXEV-AMP4 Microchip Technology, MCP6XXXEV-AMP4 Datasheet - Page 18
![BOARD AMPLIFIER EVAL 4 MCP6XXX](/photos/9/17/91716/mcp6xxxev-amp4_sml.jpg)
MCP6XXXEV-AMP4
Manufacturer Part Number
MCP6XXXEV-AMP4
Description
BOARD AMPLIFIER EVAL 4 MCP6XXX
Manufacturer
Microchip Technology
Datasheet
1.MCP6XXXEV-AMP4.pdf
(30 pages)
Specifications of MCP6XXXEV-AMP4
Channels Per Ic
1 - Single
Amplifier Type
General Purpose
Board Type
Partially Populated
Utilized Ic / Part
8-DIP Package
Processor To Be Evaluated
MCP6xxx
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Output Type
-
Current - Output / Channel
-
Voltage - Supply, Single/dual (±)
-
-3db Bandwidth
-
Slew Rate
-
Current - Supply (main Ic)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP6XXXEV-AMP4
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
MCP6XXXEV-AMP4
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP6XXXEV-AMP4
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
DS51681A-page 14
2.4.3
There are two options available when using single op amps in SOIC-8 packages
(150 mil wide):
• Soldering onto the MCP6XXX Amplifier Evaluation Board 4, or
• Soldering it onto a separate board which is connected to the DIP-8 socket
Figure 2-10 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation
Board 4.
FIGURE 2-10:
Evaluation Board 4.
Figure 2-11 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc.
(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part #
BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket.
Figure 2-12 shows this board plugged into the MCP6XXX Amplifier Evaluation Board
4.
Note:
Note:
Amplifier Modifications Using 8-Pin SOIC Op Amps
The DIP-8 socket must be empty; only one op amp can be used at a time.
Insert the interconnect strips into the DIP-8 socket on the MCP6XXX Ampli-
fier Evaluation Board 4. Place the SOIC8EV board on the top of the inter-
connect strips with the same pin orientation. Now solder the strips to the top
board; this procedure ensures correct alignment of the strips. Clip the pins
flush with the top surface of the SOIC8EV board, then solder the SOIC-8
op amp on the top.
Op Amp in SOIC-8 package soldered onto MCP6XXX Amplifier
Solder an SOIC-8
Op Amp onto the
board
© 2007 Microchip Technology Inc.