TSSEVB Freescale Semiconductor, TSSEVB Datasheet - Page 28

• Manufacturer Part Number: TSSEVB
• Description: BOARD EVALUATION TOUCH SENSING
• Manufacturer: Freescale Semiconductor

Specifications of TSSEVB

• Sensor Type: Touch, Capacitive
• Interface: USB
• Embedded: Yes, MCU, 8-Bit
• Interface Type: USB, I2C, SCI, SPI
• Operating Voltage: 5 V
• Data Bus Width: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Sensitivity: -
• Utilized Ic / Part: -
• Sensing Range: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: S08LG32

2.3.8.1
You can use the TSSEVB board to monitor the capacitance variations on the electrodes form your
application. The TSSEVB features a Communication MCU that communicates every TSS application with
the Electrode Graphing Tool Software. This section discusses the steps required to use the TSSEVB
communication module as a bridge between your application and the Electrode Graphing Tool (EGT)
software.
2.3.8.1.1
2.3.8.1.2
This section describes the steps required to connect the TSS application to the TSSEVB Communication
module.
Freescale Semiconductor
2. To connect the SDA signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
1. Add the EGT communication files to your application. To do so, you must follow the steps
2. To access the EGT communication files, first install the EGT software. After the software is
1. Remove the jumpers located in connectors J10 (SCL) and J11 (SDA) from TSSEVB.
2. Select the appropriated voltage on connector J5 depending on the voltage supplied to your
3. Set the connector J4 jumper to position 2-3 (USB2).
4. Connect the I2C lines from your application to connector J10 and J11 as shown in
the jumper on J11.
described in "Application Setup" section of the Touch Sensing Software Electrode Graphing Tool
Users Guide (document TSSEGTUG).
installed, the EGT communication files can be found at the following path:
C:\Program Files\Freescale\Electrode Graphing Tool x.x\Example\
TSSEVB_EGT_Example\Sources\EGT
application.
must also have a ground (GND) connection between the TSS application hardware and the
TSSEVB. The TSSEVB Communication module provides the pull-up resistors for the I2C
communication.
Using the TSSEVB IIC Communication Module
Setting Up the Software
Setting Up the Hardware
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Figure 2-11. Jumper Placement for SCL Signals
Figure 2-12. Jumper Placement for SDA Signals
J10
J11
SCL
SDA
Figure
System Overview
2-13. You
2-21