NBSG11BAEVB ON Semiconductor, NBSG11BAEVB Datasheet - Page 11

• Manufacturer Part Number: NBSG11BAEVB
• Description: BOARD EVALUATION BBG NBSG11BA
• Manufacturer: ON Semiconductor

Specifications of NBSG11BAEVB

• Technology Type: Evaluation Board
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: NBSG11
• Other names: NBSG11BAEVB; NBSG11BAEVBOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
BA SUFFIX
FCBGA−16
M
M
ISSUE O
K
Z
Z
11
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50