AD9245BCP-40EB Analog Devices Inc, AD9245BCP-40EB Datasheet - Page 29

• Manufacturer Part Number: AD9245BCP-40EB
• Description: BOARD EVAL 14BIT 40MSPS 32LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9245BCP-40EB

• Number Of Adc's: 1
• Number Of Bits: 14
• Sampling Rate (per Second): 40M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 180mW @ 40MSPS
• Voltage Supply Source: Single
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9245BCP-40
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9245BCP-80
AD9245BCPRL7–80
AD9245BCPZ-80
AD9245BCPZRL7-80
AD9245BCPZ-65
AD9245BCPZRL7-65
AD9245BCPZ-40
AD9245BCPZRL7-40
AD9245BCPZ-20
AD9245BCPZRL7-20
AD9245BCP-80EB
AD9245BCP-65EB
AD9245BCP-40EB
AD9245BCP-20EB
1
2
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the
maximum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
Z = Pb-free part.
2
2
2
2
2
2
2
2
INDICATOR
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
BSC SQ
VIEW
TOP
5.00
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5 mm × 5 mm Body, Very Thin Quad
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
BSC SQ
4.75
0.20 REF
Rev. D | Page 29 of 32
0.05 MAX
0.02 NOM
(CP-32-2)
0.60 MAX
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.08
1
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
EXPOSED
PAD
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
Package Option
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
AD9245