KIT33886DHEVB Freescale Semiconductor, KIT33886DHEVB Datasheet - Page 18

• Manufacturer Part Number: KIT33886DHEVB
• Description: KIT EVAL FOR MC33886 H-BRIDGE
• Manufacturer: Freescale Semiconductor

Specifications of KIT33886DHEVB

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33886
• Primary Attributes: 5 V ~ 40 V Supply, 5A Output
• Secondary Attributes: Short-Circuit, Thermal & Undervoltage Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

performance. The significant feature of this device is the
exposed copper pad on which the power die is soldered. This
pad is soldered on a PCB to provide heat flow to ambient and
also to provide thermal capacitance. The more copper area
on the PCB, the better the power dissipation and transient
behavior will be.
bottom side area of copper is 7.8 cm
(see
18
33886
FUNCTIONAL DEVICE OPERATION
PERFORMANCE
The 33886 is designed for enhanced thermal
Example Characterization on a double-sided PCB:
Figure
Top Side
21); grid array of 24 vias 0.3 mm in diameter.
Figure 21. PCB Test Layout
2
; top surface is 2.7 cm
Bottom Side
PERFORMANCE
2
soldered on to the test PCB described in
Rth (°C/W)
100
Figure 22
0,1
10
1
0,001
Figure 22. 33886 Thermal Response
0,01
shows the thermal response with the device
0,1
Analog Integrated Circuit Device Data
1
t, Time (s)
Freescale Semiconductor
10
Figure
100
21.
1000
10000