MPC5553EVB Freescale Semiconductor, MPC5553EVB Datasheet - Page 8

• Manufacturer Part Number: MPC5553EVB
• Description: KIT EVAL MPC5553MZP132
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC5553EVB

• Contents: Eval Board and Demo Software
• Processor To Be Evaluated: MPC55xx
• Data Bus Width: 32 bit
• Interface Type: RS-232, Ethernet
• For Use With/related Products: MPC5553
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
dissipation on the printed circuit board surrounding the device. This description is most useful for
packages with heat sinks where 90% of the heat flow is through the case to heat sink to ambient.
For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal
resistance and the junction-to-case thermal resistance. The junction-to-case thermal resistance describes
when using a heat sink or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. This model can be used to generate simple estimations and for
computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the
thermal characterization parameter (Ψ
temperature at the top center of the package case using the following equation:
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA., 94043
[phone]
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
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1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999,
pp. 212–220.
where:
T
T
Ψ
P
D
J
T
JT
= T
= thermocouple temperature on top of the package (
= power dissipation in the package (W)
= thermal characterization parameter (
T
+ (Ψ
JT
× P
MPC5553 Microcontroller Data Sheet, Rev. 3.0
D
)
JT
) to determine the junction temperature by measuring the
o
C/W)
o
C)
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