G2R-1A-E-DC12 Omron, G2R-1A-E-DC12 Datasheet - Page 16

• Manufacturer Part Number: G2R-1A-E-DC12
• Description: RELAY PWR SPST-NO 16A 12VDC
• Manufacturer: Omron
• Series: G2Rr

Specifications of G2R-1A-E-DC12

• Relay Type: General Purpose
• Coil Resistance: 275 Ohms
• Contact Form: SPST-NO (1 Form A)
• Contact Rating (current): 16A
• Switching Voltage: 380VAC, 125VDC - Max
• Coil Type: Standard
• Coil Current: 43.6mA
• Coil Voltage: 12VDC
• Turn On Voltage (max): 8.4 VDC
• Turn Off Voltage (min): 1.8 VDC
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Circuit: SPST-NO (1 Form A)
• Contact Rating @ Voltage: 16A @ 250VAC
• Control On Voltage (max): 8.4 VDC
• Control Off Voltage (min): 1.8 VDC
• Contact Rating: 16 A
• Contact Termination: Solder Pin
• Mounting Style: Through Hole
• Power Consumption: 530 mW
• Contact Material: Silver Alloy
• Coil Voltage Vdc Nom: 12V
• Contact Current Max: 16A
• Contact Voltage Ac Nom: 250V
• Contact Voltage Dc Nom: 30V
• Contact Configuration: SPST-NO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: G2R-1A-E-DC12; G2R1AEDC12; Z2307

PCB Design
■ Soldering
As demands for more compact electronic devices have grown, so
have demands declined for the plug-in relays that requires a bulky
socket for connection. This trend has lead to the development of
relays that can be soldered directly onto the PCB. Smaller relays
have made possible great density increases on the PCB, which in
turn reduces the size of the product or device. However, unless the
relay is fully sealed, when soldered onto a PCB, flux may penetrate
into the housing, adversely affecting the internal circuitry.
The following points will help when designing a product which uses
relays. This section points out details to be noted when soldering a
relay to a PCB.
■ PCB Materials
Generally, the substrate of a PCB is made of glass epoxy (GE),
paper epoxy (PE), or paper phenol (PP). Of these, the glass-epoxy or
paper-epoxy PCB is recommended for mounting relays. See the fol-
lowing table
■ PCB Thickness
PCBs having a thickness of 0.8, 1.2, 1.6, or 2.0 mm are generally
used. A PCB that is 1.6 mm thick is best for mounting a PCB relay,
considering the weight of the relay and the length of the terminals.
(The terminal length of OMRON relays is 3, 3.5, or 4.0 to 5.0 mm.)
■ Terminal Hole Diameter and
Select the appropriate terminal hole and land diameters from the fol-
lowing table, based on the PCB mounting hole drawing. Land diame-
ters may be reduced to less than those listed below if the through-
hole connection process is to be employed.
16
Electrical characteristics
Mechanical characteristics
Cost Effectiveness
0.6 mm
0.8 mm
1.0 mm
1.2 mm
1.3 mm
1.5 mm
1.6 mm
2.0 mm
Land Diameter
Normal
Terminal Hole Diameter
Item
Electromechanical Relays
Terminal Hole and Land Diameters
3.5
±0.1 mm
Tolerance
resistance hardly affected by humidity.
change in temperature or humidity.
Suitable for through-hole PCBs and
multi-layered PCBs.
Expensive
High insulation resistance. Insulation
Little expansions/shrinkage caused by
Glass Epoxy (GE)
1.5 mm
1.8mm
2.0mm
2.5mm
2.5mm
3.0mm
3.0mm
3.0mm
Minimum Land
Technical Information
Diameter
Epoxy Based
Fair
Fair
Fair
■ PCB Selection
In general, relays are directly mounted and soldered onto a PCB.
Although seemingly an uninvolved process, soldering and its related
processes of flux application, relay mounting, heat application, and
washing can be detrimental to a relay’s performance. For example, if
the PCB were to warp, the internal mechanism of the relay could
become distorted, degrading the performance characteristics. Thus it
could be said that the relay’s characteristics are also affected by the
size, thickness, and material of the PCB. Therefore, carefully select a
PCB that will not jeopardize the performance of the relay.
■ Shape of Lands
The land section should be on the center line of the copper-foil pat-
tern, so that the soldered fillets become uniform.
A break in the circular land area will prevent molten solder from filling
holes reserved for components which must be soldered manually
after the automatic soldering of the PCB is complete.
Correct
Incorrect
Paper Epoxy (PE)
Insulation resistance degraded by hu-
midity.
Much expansion/shrinkage caused by
changes in temperature or humidity.
Not suitable for through-hole PCB.
Fair
0.2 to 0.5 mm
Break in land
Paper Phenol (PP)
Phenol-based