SDT-S-148DMR,000 Tyco Electronics, SDT-S-148DMR,000 Datasheet - Page 4

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SDT-S-148DMR,000

Manufacturer Part Number
SDT-S-148DMR,000
Description
RELAY PWR MINI 10A PCB
Manufacturer
Tyco Electronics
Series
SDT-R, OEGr

Specifications of SDT-S-148DMR,000

Relay Type
General Purpose
Contact Form
SPST-NO (1 Form A)
Contact Rating (current)
10A
Switching Voltage
250VAC
Coil Type
Standard
Coil Current
11.25mA
Coil Voltage
48VDC
Turn On Voltage (max)
36 VDC
Turn Off Voltage (min)
4.8 VDC
Mounting Type
Through Hole
Termination Style
PC Pin
Circuit
SPST-NO (1 Form A)
Contact Rating @ Voltage
10A @ 250VAC
Control On Voltage (max)
36 VDC
Control Off Voltage (min)
4.8 VDC
Mounting Style
PCB
Power Consumption
540 mW
Contact Material
Silver Tin Oxide
Coil Resistance
4400 Ohms
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1461023-2
6
7
Rev. A1
5.15 耐寒性
5.16 耐湿性
5.17 熱衝撃性
5.18 半田耐熱性
5.19 半田付け性
標準試験状態
STANDARDS TEST CONDITION
6.1 温度
6.2 湿度
6.3 測定条件
使用条件
OPERATING CONDITION
7.1 温度
7.2 湿度
7.3 取付け方向
SOLDERABILITY
TEMPERATURE
HUMIDITY
DIRECTON OF MEASUREMENT
TEMPERATURE
HUMIDITY
MOUNTING DIRECTION
COLD PROOF
THERMAL SHOCK
SOLDERING THERMAL
HUMIDITY PROOF
Product Specification
-40℃中に 240 時間放置し、その後 2 時間常温・常湿中に放置し、
温度 40℃ 湿度 90%RH 中に 240 時間放置し、その後 2 時間常
温・常湿中に放置し、絶縁抵抗 10MΩ以上構造・特性に異常
なきこと。
高温(85℃) 0.5 時間、低温 (-40℃) 0.5 時間を 1 サイクルとして
350±5℃の溶融半田に 3 秒間又は、260±5℃の溶液半田に
260℃ 5 秒間にて正常に付くこと。
23±5℃
60±10%RH
端子を下とする方向を標準とする。
-30~60℃(但し、氷結・結露のないこと)
20~85%RH
端子を下とする方向を標準とする。
構造・特性に異常なきこと。
Not any trouble on construction and characteristic when leave in -40℃ 240h
After that, leave it in standard condition for 2 hours.
characteristic when leave in 40℃ 90% 240h. After that, leave it in
standard condition for 2 hours.
100 サイクル繰り返した後、常温に 2 時間放置した後、構造・特性
に異常なきこと。
Not any troubles on construction and characteristic when leave it in -40℃ and
85℃ temp. room for 0.5 h each. That is one cycle. After 100 cycles has done, leave
it on standard condition for 2 hours.
10 秒間端子を浸漬し構造・特性に異常なきこと。
Not any troubles on construction and characteristic. When dipped into soldering
bath 350±5℃ 3sec. or 260±5℃ 10sec.
Not any problems solder dipped at 260℃ 5 sec.
Terminal down position is standard position
Insulation resistance 10MΩ Min. Not any troubles on construction and
Terminals down position is standard position.
(On conditions without freezing and dew condensation)
108-79440
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