TLA-6T103LF TDK Corporation, TLA-6T103LF Datasheet - Page 10
![XFRMR FOR QS6611 CHIP SET 16SOP](/photos/10/14/101406/16-sop_pkg_sml.jpg)
TLA-6T103LF
Manufacturer Part Number
TLA-6T103LF
Description
XFRMR FOR QS6611 CHIP SET 16SOP
Manufacturer
TDK Corporation
Series
TLAr
Datasheet
1.TLA-6T211A.pdf
(38 pages)
Specifications of TLA-6T103LF
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
-
Inductance
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLA-6T103LF-T
Manufacturer:
TDK
Quantity:
1 150
PACKAGING STYLES
Quantity : 600pieces/reel
TAPE DIMENSIONS
REEL DIMENSIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Temperature is measured at the terminal portion of product
• This profile is reference data we recommend. Please check in
• For reliable soldering, the thickness of solder paste screen
• The cutted end of terminal has no plating(out of subject of solder
• All specifications are subject to change without notice.
ø21±0.8
260˚C max.
230˚C
165±15˚C
ø1.5+0.1, -0
(Using thermocoupler for measurement).
your actual process.
should be over the terminal co-planality.
ability).
2˚C/s
2±0.5
16
ø13±0.2
Time ( s )
120s max.
2
30s max.
1 to 2˚C/s
4
Natural
cooling
13.1
RECOMMENDED CONDITION FOR LONG TERM STORE
When it stores for a long term, please avoid place of high tempera-
ture and high humidity. Recommend that it uses after the delivery
within 1year.
Temperature range: +5 to +30°C
Humidity: 60(%)RH max.
6.1
0.4
50.4max.
Dimensions in mm
Dimensions in mm
005-04 / 20100212 / edlan_tla.fm
(9/37)