T495D226K035ATE300 Kemet, T495D226K035ATE300 Datasheet - Page 14

CAPACITOR TANT 22UF 35V 10% SMD

T495D226K035ATE300

Manufacturer Part Number
T495D226K035ATE300
Description
CAPACITOR TANT 22UF 35V 10% SMD
Manufacturer
Kemet
Series
T495r
Type
Moldedr
Datasheet

Specifications of T495D226K035ATE300

Capacitance
22µF
Voltage - Rated
35V
Tolerance
±10%
Esr (equivalent Series Resistance)
300.0 mOhm
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
2917 (7343 Metric)
Size / Dimension
0.287" L x 0.169" W (7.30mm x 4.30mm)
Height
0.110" (2.80mm)
Manufacturer Size Code
D
Features
General Purpose
Voltage Rating
35 Volts
Esr
300 mOhms
Operating Temperature Range
- 55 C to + 125 C
Mfr Case Code
D Case
Dimensions
4.3 mm W x 7.3 mm L x 2.8 mm H
Dissipation Factor Df
6
Lead Spacing
1.3 mm
Leakage Current
7.7 uAmps
Product
Tantalum Solid Low ESR Standard Grade
Ripple Current
283 mAmps
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-3880-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
T495D226K035ATE300
Manufacturer:
Kemet
Quantity:
220 406
Part Number:
T495D226K035ATE300
Manufacturer:
KEMET进口
Quantity:
20 000
Low ESR MnO
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Table 2 – Land Dimensions/Courtyard
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
¹ Height of these chips may create problems in wave soldering.
² Land pattern geometry is too small for silkscreen outline.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
KEMET
Case
Temperature
C
D
A
B
T
V
125° C
25° C
85° C
2
7343-31
7260-38
7343-20
7343-43
Metric
3216-18
3528-19
6032-28
3528-12
Code
Tantalum Surface Mount Capacitors – T495 Surge Robust Low ESR MnO
Size
EIA
1.35
2.35
2.35
2.55
4.25
2.35
2.55
2.55
Permissible Transient Reverse Voltage
X
Maximum (Most) Land
2.65
2.65
2.15
2.15
3.75
2.15
3.75
3.75
Density Level A:
Protrusion (mm)
Y
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
2.60
3.20
1.45
1.45
2.70
1.45
2.70
2.70
C
10.20
10.20
10.20
10.10
8.90
6.10
6.10
6.10
V1
2.80
4.00
4.40
5.50
7.20
4.00
5.50
5.50
V2
1.25
2.25
2.25
2.45
2.25
2.45
2.45
4.15
X
Median (Nominal) Land
2.25
3.35
2.25
3.35
3.35
1.75
1.75
1.75
Density Level B:
Protrusion (mm)
Y
2
Series
2.50
2.60
3.30
2.60
2.60
1.35
1.35
1.35
C
5.00
5.00
5.00
7.80
9.10
9.40
9.10
9.10
V1
3.90
2.30
3.50
5.00
6.70
3.50
5.00
5.00
V2
2.35
4.05
2.35
2.35
1.15
2.15
2.15
2.15
X
Minimum (Least) Land
1.35
1.35
1.85
2.95
1.85
1.35
2.95
2.95
Density Level C:
Protrusion (mm)
Y
T2009-1 • 1/17/2011
1.25
1.25
2.40
2.50
3.00
1.25
2.50
2.50
C
6.90
8.20
8.20
8.20
4.10
4.10
8.10
4.10
V1
2.00
3.20
3.60
6.40
3.20
4.70
4.70
4.70
V2
14 14

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