T495X337K010ATE060 Kemet, T495X337K010ATE060 Datasheet - Page 15
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T495X337K010ATE060
Manufacturer Part Number
T495X337K010ATE060
Description
CAPACITOR TANT 330UF 10V 10% SMD
Manufacturer
Kemet
Series
T495r
Type
Moldedr
Datasheet
1.T495D685K035ASE400.pdf
(23 pages)
Specifications of T495X337K010ATE060
Capacitance
330µF
Voltage - Rated
10V
Tolerance
±10%
Esr (equivalent Series Resistance)
60.0 mOhm
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
2917 (7343 Metric)
Size / Dimension
0.287" L x 0.169" W (7.30mm x 4.30mm)
Height
0.157" (4.00mm)
Manufacturer Size Code
X
Features
General Purpose
Voltage Rating
10 Volts
Esr
60 mOhms
Operating Temperature Range
- 55 C to + 125 C
Dimensions
4.3 mm W x 7.3 mm L
Mfr Case Code
X Case
Product
Tantalum Solid Low ESR Standard Grade
Dissipation Factor Df
8
Lead Spacing
1.3 mm
Leakage Current
33 uAmps
Ripple Current
663 mAmps
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-3903-2
T495X337K010ATE100
T495X337K010ATE100
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
T495X337K010ATE060
Manufacturer:
KEMET
Quantity:
26 000
Low ESR MnO
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Time 25°C to peak temperature
Silver Paint
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Leadframe
(-Cathode)
temperature (t
Preheat/Soak
s
) from T
2
smin
Tantalum Surface Mount Capacitors – T495 Surge Robust Low ESR MnO
MNO
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
2
Carbon
/Ta
2
Sn-Pb Assembly
O
5
/Ta
6 minutes max
3°C/sec max
6°C/sec max
Tantalum Wire
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
Silver Adhesive
Weld
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
Washer
Leadframe
(+Anode)
T
T
25
2
smax
smin
Series
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2009-1 • 1/17/2011
t
L
t
P
15 15