T496X227K010ATE500 Kemet, T496X227K010ATE500 Datasheet - Page 10

• Manufacturer Part Number: T496X227K010ATE500
• Description: CAPACITOR TANT 220UF 10V 10% SMD
• Manufacturer: Kemet
• Series: T496r
• Type: Moldedr

Specifications of T496X227K010ATE500

• Capacitance: 220µF
• Voltage - Rated: 10V
• Tolerance: ±10%
• Esr (equivalent Series Resistance): 500.0 mOhm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 2917 (7343 Metric)
• Size / Dimension: 0.287" L x 0.169" W (7.30mm x 4.30mm)
• Height: 0.157" (4.00mm)
• Manufacturer Size Code: X
• Features: Fail Safe with Built-in Fuse
• Voltage Rating: 10 Volts
• Esr: 500 mOhms
• Operating Temperature Range: - 55 C to + 125 C
• Mfr Case Code: X Case
• Dimensions: 4.3 mm W x 7.3 mm L x 4 mm H
• Dissipation Factor Df: 8
• Lead Spacing: 1.3 mm
• Leakage Current: 13.2 uAmps
• Product: Tantalum Solid Fused
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-3975-2; T496X227K010AT

Fused MnO
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Table 2 – Land Dimensions/Courtyard
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
¹ Height of these chips may create problems in wave soldering.
² Land pattern geometry is too small for silkscreen outline
.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
KEMET
Case
X¹
Temperature
C
D
B
125° C
25° C
85° C
2
Tantalum Surface Mount Capacitors – T496 Fused MnO
7343-31
7343-43
Metric
3528-21
6032-28
Code
Size
EIA
2.35
2.35
2.55
2.55
Permissible Transient Reverse Voltage
X
Maximum (Most) Land
2.65
2.15
3.75
3.75
Density Level A:
Protrusion (mm)
Y
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
2.60
1.45
2.70
2.70
C
10.20
10.20
8.90
6.10
V1
4.00
4.40
5.50
5.50
V2
2
Series
2.25
2.25
2.45
2.45
X
Median (Nominal) Land
2.25
3.35
3.35
1.75
Density Level B:
Protrusion (mm)
Y
2.50
2.60
2.60
1.35
C
5.00
7.80
9.10
9.10
V1
3.90
5.00
5.00
3.50
V2
2.35
2.35
2.15
2.15
X
Minimum (Least) Land
1.35
1.85
2.95
2.95
Density Level C:
Protrusion (mm)
Y
T2010-1 • 1/17/2011
1.25
2.40
2.50
2.50
C
6.90
8.20
8.20
4.10
V1
3.20
3.60
4.70
4.70
V2
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