06035C821KAT2A AVX Corporation, 06035C821KAT2A Datasheet

CAP CERM 820PF 10% 50V X7R 0603

06035C821KAT2A

Manufacturer Part Number
06035C821KAT2A
Description
CAP CERM 820PF 10% 50V X7R 0603
Manufacturer
AVX Corporation
Datasheets

Specifications of 06035C821KAT2A

Capacitance
820pF
Package / Case
0603 (1608 Metric)
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.90mm Max
Tolerance (+ Or -)
10%
Voltage
50VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
1.6mm
Product Depth (mm)
0.81mm
Product Height (mm)
0.86mm
Product Diameter (mm)
Not Requiredmm
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
0.81 mm W x 1.6 mm L x 0.860 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
 Details
Other names
478-1214-2
X7R Dielectric
General Specifications
PART NUMBER (see page 2 for complete part number explanation)
10.00
1.00
0.10
-10
-15
-20
-25
0.01
(L" x W")
10
-5
0805
5
0
Variation of Impedance with Cap Value
10
Size
-60 -40 -20
Typical Temperature Coefficient
1,000 pF vs. 10,000 pF - X7R
Impedance vs. Frequency
X7R Dielectric
Temperature °C
Frequency, MHz
0
100V = 1
200V = 2
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
0805
20
5
100
40
60
80 100 120 140
Dielectric
X7R = C
10,000 pF
1,000 pF
C
1000
Capacitance
2 Sig. Digits +
Code (In pF)
Number of
+30
+20
+10
-10
-20
-30
1.0
0.1
.01
10
103
Zeros
1KHz
0
Variation of Impedance with Chip Size
1
Impedance vs. Frequency
Capacitance vs. Frequency
10 KHz
10,000 pF - X7R
Capacitance
10
M = ± 20%
Tolerance
K = ±10%
Frequency, MHz
Preferred
J = ± 5%
Frequency
M
100 KHz
X7R formulations are called “temperature stable” ceramics
and fall into EIA Class II materials. X7R is the most popular
of these intermediate dielectric constant materials. Its tem-
perature variation of capacitance is within ±15% from
-55°C to +125°C. This capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical
operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capaci-
tance due to applied voltages are acceptable.
1206
0805
1210
100
1 MHz
Applicable
A = Not
Failure
Rate
A
10 MHz
1,000
Terminations
T = Plated Ni
7 = Gold
10,000
1,000
1.0
0.1
.01
10
and Sn
Plated
100
Variation of Impedance with Chip Size
T
1
0
0
Insulation Resistance vs Temperature
Impedance vs. Frequency
20
100,000 pF - X7R
Factory For
7 = Bulk Cass.
9 = Bulk
2 = 7" Reel
4 = 13" Reel
Packaging
Multiples
10
Contact
Frequency, MHz
40
Temperature °C
2
60
1206
0805
1210
100
80
Special
A = Std.
Product
Code
100
A
1,000
11
120

Related parts for 06035C821KAT2A

06035C821KAT2A Summary of contents

Page 1

... Frequency, MHz X7R formulations are called “temperature stable” ceramics and fall into EIA Class II materials. X7R is the most popular of these intermediate dielectric constant materials. Its tem- perature variation of capacitance is within ±15% from -55°C to +125°C. This capacitance change is non-linear. ...

Page 2

X7R Dielectric Specifications and Test Methods Parameter/Test Operating Temperature Range Capacitance Dissipation Factor Insulation Resistance Dielectric Strength Appearance Capacitance Resistance to Variation Flexure Dissipation Stresses Factor Insulation Resistance ≥ 95% of each terminal should be covered Solderability Appearance No defects, ...

Page 3

X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 Soldering Reflow Only Reflow Only Packaging All Paper All Paper MM 0.60 ± 0.03 1.00 ± 0.10 (L) Length (in.) (0.024 ± 0.001) (0.040 ± 0.004) MM 0.30 ± ...

Page 4

X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 1210 Soldering Reflow/Wave Packaging Paper/Embossed MM 3.20 ± 0.20 (L) Length (in.) (0.126 ± 0.008) MM 2.50 ± 0.20 (W) Width (in.) (0.098 ± 0.008) MM 0.50 ± 0.25 (t) Terminal ...

Page 5

... The solder temperature should not exceed 230°C. Chips 1808 and larger to use reflow soldering only. Capacitors with X7R Dielectrics are not intended for AC line filtering applications. Contact plant for recommendations. Capacitors may require protective surface coating to prevent external arcing ...

Page 6

High Voltage Chips For 500V to 5000V Applications C0G Dielectric PERFORMANCE CHARACTERISTICS Capacitance Range Capacitance Tolerances Dissipation Factor Operating Temperature Range Temperature Characteristic Voltage Ratings Insulation Resistance (+25°C, at 500 VDC) Insulation Resistance (+125°C, at 500 VDC) Dielectric Strength HIGH ...

Page 7

Packaging of Chip Components Automatic Insertion Packaging TAPE & REEL QUANTITIES All tape and reel specifications are in compliance with RS481. Paper or Embossed Carrier Embossed Only Paper Only Qty. per Reel/7" Reel 2,000, 3,000 or 4,000, 10,000, 15,000 Contact ...

Page 8

Embossed Carrier Configuration 8 & 12mm Tape Only DEFORMATION BETWEEN EMBOSSMENTS TOP COVER B TAPE FOR TAPE READER REFERENCE ONLY 1 INCLUDING DRAFT CONCENTRIC AROUND B 8 & ...

Page 9

Paper Carrier Configuration 8 & 12mm Tape Only T BOTTOM TOP COVER COVER TAPE TAPE & 12mm Paper Tape Metric Dimensions Will Govern CONSTANT DIMENSIONS Tape Size +0.10 8mm 1.50 1.75 ± ...

Page 10

Bulk Case Packaging BENEFITS • Easier handling • Smaller packaging volume (1/20 of T/R packaging) • Easier inventory control • Flexibility • Recyclable CASE DIMENSIONS Shutter Slider 12mm 36mm 110mm Attachment Base CASE QUANTITIES Part Size 0402 Qty. 80,000 (pcs ...

Page 11

... XII. Power Loss (watts) Power Loss = (2 π fCV 2 XIII. KVA (Kilowatts) KVA = 2 π fCV - XIV. Temperature Characteristic (ppm/°C) Ct – – 25 XV. Cap Drift (%) C – C. 100 C 1 XVI. Reliability of Ceramic Capacitors ( ) ( XVII. Capacitors in Series (current the same) Any Number --- Two ...

Page 12

... General Description Basic Construction – A multilayer ceramic (MLC) capaci- tor is a monolithic block of ceramic containing two sets of offset, interleaved planar electrodes that extend to two opposite surfaces of the ceramic dielectric. This simple Ceramic Layer Formulations – Multilayer ceramic capacitors are available in both Class 1 and Class 2 formulations. Temperature ...

Page 13

General Description Table 1: EIA and MIL Temperature Stable and General Application Codes EIA CODE Percent Capacity Change Over Temperature Range RS198 Temperature Range X7 -55°C to +125°C X5 -55°C to +85°C Y5 -30°C to +85°C Z5 +10°C to +85°C ...

Page 14

... A typical curve of aging rate for semi- stable ceramics is shown in Figure Class 2 ceramic capacitor that has been sitting on the shelf for a period of time, is heated above its curie point, (125°C for 4 hours or 150°C for 1 ⁄ ...

Page 15

... As a general statement, the piezoelectric output is higher, the higher the dielectric constant of the ceramic desirable to investigate this effect before using high “K” dielectrics as coupling capaci- tors in extremely low level applications. ...

Page 16

... Another important, often overlooked, reason for knowing the parasitic inductance is the calculation of the resonant frequency. This can be important for high frequency, by- pass capacitors, as the resonant point will give the most V signal attenuation. The resonant frequency is calculated from the simple equation: ...

Page 17

... Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: WAVE SOLDERING D2 ...

Page 18

... Handling Chip multilayer ceramic capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of tweezers or vacuum pick ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized ...

Page 19

... AVX strongly recommends that any reworking of MLCs be done with hot air reflow rather than soldering irons practically impossi- ble to cause any thermal shock in ceramic capacitors when using hot air reflow. However direct contact by the soldering iron tip often caus- es thermal cracks that may fail at a later date ...

Page 20

... Surface Mounting Guide MLC Chip Capacitors Preferred Method - No Direct Part Contact PCB BOARD DESIGN To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is located ...

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