GRM31A7U2J101JW31D Murata Electronics North America, GRM31A7U2J101JW31D Datasheet - Page 2

• Manufacturer Part Number: GRM31A7U2J101JW31D
• Description: CAP CER 100PF 630VDC U2J 1206
• Manufacturer: Murata Electronics North America
• Series: GRMr

Specifications of GRM31A7U2J101JW31D

• Capacitance: 100pF
• Voltage - Rated: 630V
• Tolerance: ±5%
• Temperature Coefficient: U2J
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Package / Case: 1206 (3216 Metric)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Thickness: 1.00mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 490-4290-2

No.
11 Deflection
12
13
14
15
16 Life
* "Room condition" Temperature: 15 to 35 C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Medium Voltage Low Dissipation Factor Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
Item
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Q
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly
and continuously.
No marking defects
Within T2.5%
1,000 min.
More than 10,000M
In accordance with item No.4
No marking defects
Within T2.5%
500 min.
More than 10,000M
In accordance with item No.4
No marking defects
Within T5.0%
350 min.
More than 1,000M
In accordance with item No.4
No marking defects
Within T3.0%
350 min.
More than 1,000M
In accordance with item No.4
2.0Z1.25
3.2Z1.6
3.2Z2.5
4.5Z2.0
4.5Z3.2
5.7Z5.0
LZW
(mm)
1.2
2.2
2.2
3.5
3.5
4.5
a
Specifications
d
Fig. 2
Dimension (mm)
100
4.0
5.0
5.0
7.0
7.0
8.0
b
a
c
b
4.5
1.65
2.0
2.9
2.4
3.7
5.6
c
t : 1.6
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150D * for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1 sec.
Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
*Preheating for more than 3.2Z2.5mm
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
Apply voltage as in Table for 1,000
operating temperature T3D.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
The charge/discharge current is less than 50mA.
DC2kV, DC3.15kV
DC630V, DC1kV,
Step
Step
Rated Voltage
W24
Y
1
2
1
2
3
4
DC250V
0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Temperature
Room Temp.
Room Temp.
100 to 120D
170 to 200D
45
Fig. 4
Test Method
20 50
Fig. 3
150% of the rated voltage
120% of the rated voltage
45
Pressurize
Pressurizing
speed: 1.0mm/s
Applied Voltage
W48
Y
Flexure=1
0
Solder resist
Cu
hrs. at maximum
(in mm)
Time (min.)
1 min.
1 min.
30T3
2 to 3
30T3
2 to 3
Time