GA342QR7GD471KW01L Murata Electronics North America, GA342QR7GD471KW01L Datasheet - Page 147
![CAP CER 250VAC 470PF X7R 1808](/photos/10/44/104491/1808_murata_mlcc_caps_sml.jpg)
GA342QR7GD471KW01L
Manufacturer Part Number
GA342QR7GD471KW01L
Description
CAP CER 250VAC 470PF X7R 1808
Manufacturer
Murata Electronics North America
Series
GDr
Datasheets
1.GNM1M2R71E472MA01D.pdf
(4 pages)
2.GA342QR7GD471KW01L.pdf
(221 pages)
3.GA342QR7GD471KW01L.pdf
(1 pages)
Specifications of GA342QR7GD471KW01L
Capacitance
470pF
Voltage - Rated
250VAC
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
Safety
Ratings
Y3
Package / Case
1808 (4520 Metric)
Size / Dimension
0.177" L x 0.079" W (4.50mm x 2.00mm)
Thickness
1.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Spacing
-
Other names
490-3487-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GA342QR7GD471KW01L
Manufacturer:
MURATA
Quantity:
640 000
- GNM1M2R71E472MA01D PDF datasheet
- GA342QR7GD471KW01L PDF datasheet #2
- GA342QR7GD471KW01L PDF datasheet #3
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Soldering and Mounting
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
145
C02E.pdf
10.12.20
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