GA355QR7GF182KW01L Murata Electronics North America, GA355QR7GF182KW01L Datasheet - Page 150
GA355QR7GF182KW01L
Manufacturer Part Number
GA355QR7GF182KW01L
Description
CAP CER 250VAC 1800PF X7R 2220
Manufacturer
Murata Electronics North America
Series
GFr
Datasheets
1.GNM1M2R71E472MA01D.pdf
(4 pages)
2.GA342QR7GD471KW01L.pdf
(221 pages)
3.GA355QR7GF182KW01L.pdf
(1 pages)
Specifications of GA355QR7GF182KW01L
Capacitance
1800pF
Voltage - Rated
250VAC
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
Safety
Ratings
X1Y2
Package / Case
2220 (5750 Metric)
Size / Dimension
0.224" L x 0.197" W (5.70mm x 5.00mm)
Thickness
1.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Other names
490-3479-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GA355QR7GF182KW01L
Manufacturer:
MURATA
Quantity:
640 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
4. Flux Application
1. An excessive amount of flux generates a large quantity of
2. Flux containing too high a percentage of halide may
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
2. Unsuitable cleaning solvent may leave residual flux or
148
Notice
Notice
disconnect during flow soldering and deterioration in the
insulation resistance between the outer electrodes due to
moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
flux gas, which can cause a deterioration of Solderability.
Therefore apply flux thinly and evenly throughout. (A
foaming system is generally used for flow soldering.)
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.2%
max.
and conditions to confirm the quality and select the
applicable solvent.
other foreign substances, causing deterioration of
electrical characteristics and the reliability of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
3. Do not use strong acidic flux.
4. Do not use water-soluble *flux.
3. Select the proper cleaning conditions.
[As a Single Chip]
[As Mounted on Substrate]
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
capacitors.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
B
C
A
Continued on the following page.
B
A
D
Outer Electrode
C02E.pdf
10.12.20
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