C3225C0G2J682J TDK Corporation, C3225C0G2J682J Datasheet - Page 23
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C3225C0G2J682J
Manufacturer Part Number
C3225C0G2J682J
Description
CAP CER 6800PF 630V C0G 5% 1210
Manufacturer
TDK Corporation
Series
Cr
Specifications of C3225C0G2J682J
Capacitance
6800pF
Voltage - Rated
630V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
General Purpose
Package / Case
1210 (3225 Metric)
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Thickness
2.00mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-2353-2
C3225C0G2J682JT
C3225COG2J682J
C3225C0G2J682JT
C3225COG2J682J
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C3225C0G2J682J200AA
Manufacturer:
MICRON
Quantity:
3 000
Company:
Part Number:
C3225C0G2J682J700
Manufacturer:
YAGEO
Quantity:
30 000
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material : Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness : Appendix-2a
General
Specifications
Applied for C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Appendix - 1a
Appendix - 2a
Applied for C1005
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
C Series — Mid Voltage Application
c
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
US Catalog // C Series — Mid Voltage Application // Version A11
c
Solder Resist
100 mm
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.5
1.2
2.0
2.9
3.7
5.6
c