LG224Z224MAT2S1 AVX Corporation, LG224Z224MAT2S1 Datasheet
LG224Z224MAT2S1
Manufacturer Part Number
LG224Z224MAT2S1
Description
CAP CER .22UF 4V 0306 LOW IND
Manufacturer
AVX Corporation
Series
LG22 (LGA)r
Datasheet
1.LG226Z104MAT2S1.pdf
(4 pages)
Specifications of LG224Z224MAT2S1
Capacitance
0.22µF
Voltage - Rated
4V
Tolerance
±20%
Temperature Coefficient
X7S
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESL
Applications
General Purpose
Package / Case
0603 (1608 Metric) Wide, 0306 (0816 Metric)
Size / Dimension
0.030" L x 0.063" W (0.76mm x 1.60mm)
Thickness
0.55mm Max
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
478-4625-2
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly.
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
LOW INDUCTANCE CHIP CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60% or more with an LICC versus a
standard MLCC.
A real capacitor has parasitics that prevent
Slowest Capacitors
VR
Figure 1 Classic Power Delivery Network (PDN) Architecture
Bulk
Low Inductance Decoupling Capacitors
Board-Level
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
INTERDIGITATED CAPACITORS
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance.
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80% lower than an MLCC.
Package-Level
Semiconductor Product
The IDC architecture shrinks the distance
Die-Level
Fastest Capacitors
59
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LG224Z224MAT2S1 Summary of contents
Page 1
... ESLs. This tradeoff between ESL (speed of energy delivery) and capacitance (energy storage) drives the PDN design topology that places the fastest low ESL capacitors as close to the load as possible. Low Inductance MLCCs are found on semiconductor packages and on boards as close as possible to the load. ...
Page 2
... LICA ® products are used in 99.999% uptime semiconductor package applications on both ceramic and organic substrates. The C4 solder ball termination option is the perfect compliment to flip-chip packaging technology. Mainframe class CPUs, ultimate performance multi-chip modules, and communications systems that must have the reliability of 5 9’ ...
Page 3
... Frequency (MHz) Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The in- novative LGA technology sets a new standard for low inductance MLCC performance. ...
Page 4
... LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays SIZE LG12 (0204) Length mm (in.) 0.50 (0.020) Width mm (in.) 1.00 (0.039) Temp. Char. X5R (D) X7S (Z) X6S (W) Working Voltage 6.3 4 6.3 4 6.3 (6) (4) (6) (4) (6) Cap (μF) 0.010 (103) 0.022 (223) 0.047 (473) 0.100 (104) ...