CX1206MKX7R7BB224 Yageo, CX1206MKX7R7BB224 Datasheet - Page 14
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CX1206MKX7R7BB224
Manufacturer Part Number
CX1206MKX7R7BB224
Description
CAP X2Y CER .22UF X7R 1206
Manufacturer
Yageo
Series
X2Y®r
Datasheet
1.CX0603MRX7R0BB152.pdf
(16 pages)
Specifications of CX1206MKX7R7BB224
Capacitance
0.22µF
Voltage - Rated
16V
Tolerance
±20%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low Inductance
Applications
Bypass, Decoupling
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.065" W (3.20mm x 1.65mm)
Thickness
1.20mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
311-1252-2
CX1206MKX7R7BB224
CX1206MKX7R7BB224
Table 5 Test procedures and requirements (continued)
2008 Nov. 10 V.13
Phycomp
Surface-mount ceramic
EMI filter capacitors
4.6
4.15
4.8
4.9
4.10
IEC 60384-21/22
TEST METHOD
temperature
characteristic
adhesion
bond strength
of plating on
end face
Resistance to
soldering heat
Solderability
TEST
Between minimum and maximum
temperature
A force applied for 10 seconds to the line
joining the terminations and in a plane
parallel to the substrate
for size ≥ 0603: a force of 5 N applied
for size 0402: a force of 2.5 N applied
for size 0201: a force of 1 N applied
Mounting in accordance with IEC 60384-22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1
mm/s, radius jig 340 mm
Precondition: 150 +0/−10 °C for 1 hour,
then keep for 24 ±1 hours at room
temperature
Preheating: for size ≤ 1206: 120 to 150 °C
for 1 minute
Preheating: for size >1206: 100 to 120 °C
for 1 minute and 170 to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Unmounted chips completely immersed in
a solder bath at 235 ±5 °C
Dipping time: 2 ±0.5 seconds
Depth of immersion: 10 mm
PROCEDURE
14
NP0: ΔC/C: ±30 ppm/°C
X5R/X7R: ΔC/C: ±15%
Y5V: ΔC/C: +22% ~ −82%
no visible damage
no visible damage
NP0: lΔC/Cl: ≤ 1% or 0.5 pF
whichever is greater
X5R/X7R/Y5V: lΔC/Cl: ≤ 10%
The termination shall be well
tinned
NP0: lΔC/Cl: ≤ 0.5% or 0.5
pF whichever is greater
X5R/X7R: lΔC/Cl: ≤ 10%
Y5V: lΔC/Cl: ≤ 20%
D.F.: within initial specified
value
R
value
The termination shall be well
tinned
ins
: within initial specified
REQUIREMENTS
Product specification
X2Y
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