C0805C102M5RACTU Kemet, C0805C102M5RACTU Datasheet - Page 2

• Manufacturer Part Number: C0805C102M5RACTU
• Description: CAP 1000PF 50V CERAMIC X7R 0805
• Manufacturer: Kemet
• Series: C0805r

Specifications of C0805C102M5RACTU

• Capacitance: 1000pF
• Voltage - Rated: 50V
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.78mm
• Voltage Rating: 50 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: General Type MLCCs
• Dimensions: 1.25 mm W x 2 mm L x 1.3 mm H
• Dissipation Factor Df: 2.5
• Lead Spacing: 0.75 mm
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-1146-2; C0805C102M5RAC; C0805C102M5RAC7800

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3VDC–250VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
Pb-Free and RoHS compliant
Code
Size
0603
0402
0805
1206
1210
1808
1825
2220
2225
EIA
1812
Metric
Code
Size
4532
4564
5650
5664
1005
1608
2012
3216
3225
4520
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
Length
L
Width
W
Thickness
T
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
Bandwidth
T
B
W
S
L
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
B
Min.
N/A
S
C1002_X7R • 5/27/2011
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Mounting
100% Tin or SnPb Plate
Nickel Plate
2