C0805C155K8RACTU Kemet, C0805C155K8RACTU Datasheet - Page 11

CAP CERM 1.5UF 10V X7R 0805

C0805C155K8RACTU

Manufacturer Part Number
C0805C155K8RACTU
Description
CAP CERM 1.5UF 10V X7R 0805
Manufacturer
Kemet
Series
C0805r

Specifications of C0805C155K8RACTU

Capacitance
1.5µF
Voltage - Rated
10V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
1.25mm
Voltage Rating
10 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
1.25 mm W x 2 mm L x 1.3 mm H
Dissipation Factor Df
5
Lead Spacing
0.75 mm
Termination Style
SMD/SMT
Case Code
0805
Case Size
0805
Dielectric Characteristic
X7R
Material, Element
Ceramic
Termination
SMT
Voltage, Rating
10 VDC
Working Voltage
10, 16, 25, 50, 100 & 200V
Dielectric
C0G (NP0), X7R, X5R, Z5U & Y5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-4931-2
C0805C155K8RAC
C0805C155K8RAC7800
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3VDC–250VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A
Tape Size
Tape Size
B
hole location shall be applied independent of each other.
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).
(e) for KPS Series product A
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
12mm
16mm
12mm
16mm
1
8mm
8mm
S
1
<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
1
B
including draft concentric about B
1
is for tape feeder reference only,
T
T
Ko
T
(0.059 +0.004/-0.0)
Cover Tape
2
1
Single (4mm) &
Double (8mm)
1.5 +0.10/-0.0
Triple (12mm)
Single (4mm)
Pitch
D
0
0
, B
Center Lines of Cavity
0
and K
0
and B
o
.
0
shall surround the component with suffi cient clearance that:
0
are measured on a plane 0.3mm above the bottom of the pocket.
B
D
(0.039)
(0.059)
(0.323)
(0.476)
Note 1
Note 4
(0.171)
ØDo
1
4.35
1
12.1
8.2
1.0
1.5
User Direction of Unreeling
Max.
Min.
P
Constant Dimensions — Millimeters (Inches)
Variable Dimensions — Millimeters (Inches)
2
(0.069 ± 0.004)
1.75 ± 0.10
Po
P
1
E
(0.246)
(0.404)
(0.561)
10.25
14.25
6.25
2
E
Min.
1
tolerance on tape ±0.2 mm]
[10 pitches cumulative
Ao
ØD
1
(0.157 ± 0.004)
(0.138 ± 0.002)
(0.217 ± 0.002)
(0.217 ± 0.002)
Bo
3.5 ± 0.05
5.5 ± 0.05
5.5 ± 0.05
4.0 ± 0.10
see Note 1 Table 5
Embossment
For cavity size,
P
F
0
F
E
2
E
1
W
(0.079 ± 0.002)
(0.157 ± 0.004)
(0.315 ± 0.004)
(0.315 ± 0.004)
2.0 ± 0.05
4.0 ± 0.10
8.0 ± 0.10
8.0 ± 0.10
P
P
2
1
(0.984)
T
(0.098)
(0.181)
Note 2
(1.181)
(0.181)
R Ref.
25.0
2
2.5
4.6
4.6
30
Max
S
W Max
(0.327)
(0.484)
(0.642)
(0.024)
Note 3
0.600
C1002_X7R • 5/27/2011
12.3
16.3
1
8.3
Min.
T Max.
(0.024)
0.600
A
0
Note 5
,B
0
& K
T
(0.004)
0.100
1
Max.
0
11

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