GRM21BC81C106KA73L Murata Electronics North America, GRM21BC81C106KA73L Datasheet - Page 211

CAP CER 10UF 16V X6S 0805

GRM21BC81C106KA73L

Manufacturer Part Number
GRM21BC81C106KA73L
Description
CAP CER 10UF 16V X6S 0805
Manufacturer
Murata Electronics North America
Series
GRMr
Datasheet

Specifications of GRM21BC81C106KA73L

Capacitance
10µF
Voltage - Rated
16V
Tolerance
±10%
Temperature Coefficient
X6S
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 105°C
Applications
General Purpose
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
1.25mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
490-5519-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM21BC81C106KA73L
Manufacturer:
PANASONIC
Quantity:
30 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Vibration and Impact
3. Land Layout for Cropping PC Board
210
!Caution
[Component Direction]
Caution (Soldering and Mounting)
Do not expose a capacitor to excessive shock or vibration
during use.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Example
to be avoided>
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
<Example
of improvement>
Locate chip
horizontal to the
direction in which
stress acts.
2. Circuit Board Material
[Chip Mounting Close to Board Separation Point]
It is possible for the chip to crack by the expansion and
shrinkage of a metal board.
Please contact us if you want to use our ceramic
capacitors on a metal board such as Aluminum.
Perforation
A
Slit
B
D
C
Continued on the following page.
Chip arrangement
Worst AGCGB~D Best
C02E.pdf
10.12.20

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