EMK105B7153KV-F Taiyo Yuden, EMK105B7153KV-F Datasheet - Page 17
![CAP CERM 15000PF 16V X7R 0402](/photos/10/51/105158/0402__mk105__sml.jpg)
EMK105B7153KV-F
Manufacturer Part Number
EMK105B7153KV-F
Description
CAP CERM 15000PF 16V X7R 0402
Manufacturer
Taiyo Yuden
Series
EMKr
Datasheet
1.TMK105B7103KV-F.pdf
(18 pages)
Specifications of EMK105B7153KV-F
Capacitance
0.015µF
Voltage - Rated
16V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0402 (1005 Metric)
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Thickness
0.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
EMK105BJ153KV-F
EMK105BJ153KV-F
RM EMK105 B7153KV-F
EMK105BJ153KV-F
RM EMK105 B7153KV-F
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
5.Cleaning
6.Post cleaning processes
7.Handling
△
!
PRECAUTIONS
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
Cleaning conditions
1. When cleaning the PC board after the capacitors are all
2. Cleaning conditions should be determined after verifying,
1. With some type of resins a decomposition gas or chemical
2. When a resin's hardening temperature is higher than the
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting capacitors and
2. Board separation should not be done manually, but by us-
Mechanical considerations
1. Be careful not to subject the capacitors to excessive me-
(1) If ceramic capacitors are dropped onto the floor or a
(2) When handling the mounted boards, be careful that the
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning (e.g.
to remove soldering flux or other materials from the produc-
tion process.)
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
reaction vapor may remain inside the resin during the hard-
ening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
ing the appropriate devices.
chanical shocks.
hard surface, they should not be used.
mounted components do not come in contact with or
bump against other boards or components.
Precautions
温度 (℃)
温度 (℃)
300
400
300
200
100
200
100
0
0
(※⊿ T ≦190℃ (3216タ イ プ以下) 、 ⊿ T ≦130℃ (3225以上) 。 )
う に十分予熱を行って く だ さ い。
※回数は 2回迄の保証と な り ます。
※チッ プと はんだ温度との差が1 0 0 ∼ 1 3 0℃以下になるよ
う に十分予熱を行って く だ さ い。
※回数は 1回迄の保証と な り ます。
※リ フロー仕様アイ テムは除き ます。
※はんだコテは20Wで先端が1φ以下のものを推奨致 し ます。
※コテ先がチッ プに直接触れないよ う にご留意下さ い。
※回数は1回迄の保証と な り ます。
注 : 上記温度プロファ イルは最大許容条件であ り、
常にこれを推奨する ものではご ざいません。
(1) Excessive cleaning
[Hand soldering]
Temperature profile
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
1. The use of inappropriate solutions can cause foreign substances such as flux residue
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimen-
In the case of ultrasonic cleaning, too much power output can cause excessive vibra-
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
degradation of the capacitor's electrical properties (especially insulation resistance) .
tally affect the performance of the capacitors.
tion of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
ピーク260℃以下
120秒以上
予熱150℃
Ultrasonic output
Ultrasonic frequency
Ultrasonic washing period 5 min. or less
10秒迄
⊿ T
60秒以上
△
!
徐冷
350℃以下
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
徐冷
3秒迄
Technical considerations
Below 20 W/ℓ
Below 40 kHz
Temperature ( ℃)
Temperature ( ℃)
300
200
400
300
200
100
100
0
0
(※⊿ T ≦190℃ (3216Type max) , ⊿ T ≦130℃ (3225
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
Type min) )
components.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
the tip is 1φ or less.
soldering condition, therefore these profiles are
not always recommended.
Preheating
120 sec min
Peak 260℃ max
150℃
10 sec max
60 sec min
⊿ T
(Pb free soldering)
(Pb free soldering)
5/6
350℃ max
Gradually
3 sec max
Gradually
cooling
cooling
117
4