C1206Y103K5RACTU Kemet, C1206Y103K5RACTU Datasheet - Page 7
![CAP CER 10000PF 50V X7R 1206](/photos/10/53/105350/1206_kemet_mlcc_caps_sml.jpg)
C1206Y103K5RACTU
Manufacturer Part Number
C1206Y103K5RACTU
Description
CAP CER 10000PF 50V X7R 1206
Manufacturer
Kemet
Series
FF-CAPr
Datasheets
1.C1206Y102K5RACTU.pdf
(17 pages)
2.C0805F102K5RACTU.pdf
(3 pages)
3.C0805Y103K5RACTU.pdf
(17 pages)
Specifications of C1206Y103K5RACTU
Capacitance
10000pF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Floating Electrode, Soft Termination
Applications
Automotive, Boardflex Sensitive
Ratings
AEC-Q200
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
0.78mm
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Flexible Termination MLCCs
Dimensions
1.6 mm W x 3.4 mm L x 0.78 mm H
Dissipation Factor Df
2.5
Termination Style
SMD/SMT
Capacitor Application
General Purpose
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Capacitor Case Style
1206
Capacitor Mounting
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
C1206Y103K5RAC
C1206Y103K5RAC7800
C1206Y103K5RAC7800
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C1206Y103K5RACTU
Manufacturer:
KEMET
Quantity:
600 000
SMD MLCCs – Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
Recommended Soldering Profile
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Code
Size
0603
0805
2220
2225
1206
1210
1808
1812
1825
EIA
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1
Metric
Code
Size
1608
3216
3225
4520
4532
4564
5650
5664
2012
0.85
1.05
1.60
1.60
2.25
2.85
2.85
2.10
2.15
C
Land Protrusion (mm)
1.25
1.45
1.65
1.65
1.85
1.80
1.80
2.10
2.10
Maximum (Most)
Density Level A:
Y
2.80
2.30
3.60
6.90
5.50
6.90
1.55
1.90
1.10
X
8.80
4.00
4.60
5.90
5.90
7.40
7.00
8.80
7.10
V1
2.60
2.90
3.80
3.30
4.60
7.90
6.50
7.90
2.10
V2
0.75
0.95
1.50
1.50
2.00
2.05
2.75
2.75
2.15
C
Land Protrusion (mm)
Median (Nominal)
1.05
1.25
1.45
1.45
1.65
1.60
1.60
1.90
1.90
Density Level B:
Y
1.00
1.80
2.20
3.50
6.80
5.40
6.80
1.45
2.70
X
5.00
5.00
6.50
6.20
3.10
3.70
6.10
7.90
7.90
V1
5.90
1.50
2.00
2.30
3.20
2.70
4.00
7.30
7.30
V2
0.65
0.85
1.40
1.40
2.05
1.90
1.95
2.65
2.65
C
Land Protrusion (mm)
0.85
1.05
1.25
1.25
1.45
1.40
1.40
1.70
1.70
Minimum (Least)
Density Level C:
Y
C1015-1 • 9/14/2010
0.90
1.35
2.60
3.40
6.70
5.30
6.70
1.70
2.10
X
2.40
3.00
4.30
4.30
5.80
5.40
5.50
7.20
7.20
V1
2.00
2.90
2.40
5.60
1.20
1.70
3.70
7.00
7.00
V2
7