C1210C154K5RACTU Kemet, C1210C154K5RACTU Datasheet - Page 5
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C1210C154K5RACTU
Manufacturer Part Number
C1210C154K5RACTU
Description
CAP CER 0.15UF 50V X7R 1210
Manufacturer
Kemet
Series
C1210r
Specifications of C1210C154K5RACTU
Capacitance
0.15µF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
1210 (3225 Metric)
Size / Dimension
0.138" L x 0.102" W (3.50mm x 2.60mm)
Thickness
0.90mm
Case Code
1210
Case Size
1210
Dielectric Characteristic
X7R
Material, Element
Ceramic
Termination
SMT
Voltage, Rating
50 VDC
Working Voltage
10, 16, 25, 50, 100 & 200V
Dielectric
C0G (NP0), X7R, X5R, Z5U & Y5V
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
2.5 mm W x 3.2 mm L
Dissipation Factor Df
2.5
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
RoHS Compliant part
Other names
C1210C154K5RAC
C1210C154K5RAC7800
C1210C154K5RAC7800
92
Y
X
placement
courtyard
Grid
330mm (13.00")
178mm (7.00")
Tape & Reel Packaging
or
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Z
C
G
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
CERAMIC CHIP CAPACITORS
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
(.315 .012")
(.472 .012")
Packaging Information
12mm .30
8mm .30
or
available on punched paper only.
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Anti-Static Reel
Z
0402 and 0603 case sizes
Embossed Carrier*
* Punched paper carrier used for 0402 and 0603 case size.
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
G
Reflow Solder
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 77
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
X
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
and page 90 for MIL-PRF-55681 chips.
for details on reeling quantities for commercial chips
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
g
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
3.18
3.70
4.90
4.90
Z
Embossment
0.68
0.70
1.50
1.50
G
Not Recommended
Not Recommended
Wave Solder
0.80
1.10
1.40
2.00
X
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20