C1206X225K5RACTU Kemet, C1206X225K5RACTU Datasheet - Page 10

CAP CER 2.2UF 50V X7R 1206

C1206X225K5RACTU

Manufacturer Part Number
C1206X225K5RACTU
Description
CAP CER 2.2UF 50V X7R 1206
Manufacturer
Kemet
Series
FT-CAPr
Datasheet

Specifications of C1206X225K5RACTU

Capacitance
2.2µF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Soft Termination
Applications
Boardflex Sensitive
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
1.60mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
C1206X225K5RAC
C1206X225K5RAC7800

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C1206X225K5RACTU
Manufacturer:
KEMET
Quantity:
240 000
SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance
with EIA standard 481. This packaging system is compatible with
all tape fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
330mm (13.00")
Table 5 – Carrier Tape Configuration (mm)
*Refer to Figure 1 for W and P
*Refer to Table 6 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
178mm (7.00")
Array 0508 & 0612
EIA Case Size
KPS 1812 & 2220
or
01005 - 0402
0603 - 1210
1805 - 1808
KPS 1210
≥ 1812
1
carrier tape reference locations.
Tape size (W)*
12
12
12
16
8
8
8
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Bar Code Label
8mm, 12mm
or 16mm Carrier Tape
Pitch (P
Anti-Static Reel
12
2
4
4
8
8
4
Embossed Plastic* or
Punched Paper Carrier.
1
)*
Sprocket Holes
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip and KPS Orientation in Pocket
Embossment or Punched Cavity
C1013-1 • 9/14/2010
10

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