C1808C330MHRACTU Kemet, C1808C330MHRACTU Datasheet - Page 4

• Manufacturer Part Number: C1808C330MHRACTU
• Description: CAP CER 33PF 3000V X7R 1808
• Manufacturer: Kemet

Specifications of C1808C330MHRACTU

• Capacitance: 33pF
• Voltage - Rated: 3000V (3kV)
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Package / Case: 1808 (4520 Metric)
• Size / Dimension: 0.177" L x 0.079" W (4.50mm x 2.00mm)
• Thickness: 1.60mm
• Voltage Rating: 3 KVolts
• Temperature Coefficient / Code: X7R
• Product: High Voltage MLCCs
• Dimensions: 2 mm W x 4.5 mm L
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Details
• Other names: C1808C330MHRAC; C1808C330MHRAC7800

84
Capacitance
Cap Tolerance
DF
Voltage Ratings
Operating Temperature Range
25ºC IR @ 500V
125ºC IR @ 500V
-55ºC TCC
+125ºC TCC
Dielectric Strength
Ripple Current
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, [phone]
Capacitance Tolerance
C = ±0.25pF*
D = ±0.5pF*
F = ±1%*
G = ±2%*
* Contact KEMET Sales for availability.
Style
C - Ceramic
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Property
J = ±5%
K = ±10%
M = ±20%
Recommended Solder Pad Dimensions
CERAMIC CHIP / HIGH VOLTAGE
C
0805
C
Capacitor Ordering Information
C0G: 1 pF to 0.010 µF
X7R: 10 pf to 0.22 µF
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
From -55C to +125C
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
X7R: + 15%
C0G: + 30 ppm / ºC
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
Consult KEMET Sales Representative
102
Electrical Parameters
Soldering Process
pF
Packaging
Marking
K
C
Specification
R
* Contact KEMET Sales for availability.
A
G – (C0G) (±30ppm/C) (-55°C +125°C)
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
C
L = SnPb plated nickel barrier
Temperature Characteristic
Designated by Capacitance
C = 500V
B = 630V
D = 1000V
Failure Rate Level
A = Not Applicable
End Metallization
(SnPb 5% min)
C = Standard
G = 2000V
H = 3000V
F = 1500V
Z = 2500V
Voltage