TMK316C106KL-T Taiyo Yuden, TMK316C106KL-T Datasheet - Page 16

• Manufacturer Part Number: TMK316C106KL-T
• Description: CAP CER 10UF 25V X5S 1206
• Manufacturer: Taiyo Yuden
• Series: TMKr

Specifications of TMK316C106KL-T

• Capacitance: 10µF
• Voltage - Rated: 25V
• Tolerance: ±10%
• Temperature Coefficient: X5S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 1206 (3216 Metric)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Thickness: 1.60mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Other names: 587-1350-2; CE TMK316 C106KL-T

Precautions on the use of Multilayer Ceramic Capacitors
3.Considerations for auto-
PRECAUTIONS
matic placement
Stages
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capaci-
2. The maintenance and inspection of the mounters should be
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
tors when mounting onto the PC boards.
conducted periodically.
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period. There-
fore, it is imperative to consult the manufacturer of the adhe-
sives on proper usage and amounts of adhesive to use.
Precautions
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
1. Some adhesives may cause reduced insulation resistance. The difference between the
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting &
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
board after correcting for deflection of the board.
supporting pins or back-up pins should be used under the PC board. The following dia-
grams show some typical examples of good pick-up nozzle placement:
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
to the board may adversely affect component placement, so the following precautions
should be noted in the application of adhesives.
solder process.
Double-sided
Single-sided
mounting
mounting
Figure
a
b
c
Not recommended
Adhesives should not contact the pad
Technical considerations
212/316 case sizes as examples
100 V120 Am
0.3mm min
Recommended
3/6
91
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