ESD11N5.0ST5G ON Semiconductor, ESD11N5.0ST5G Datasheet

TVS BIDIR 250MW 5V DSN2

ESD11N5.0ST5G

Manufacturer Part Number
ESD11N5.0ST5G
Description
TVS BIDIR 250MW 5V DSN2
Manufacturer
ON Semiconductor
Datasheet

Specifications of ESD11N5.0ST5G

Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
5.8V
Polarization
Bidirectional
Mounting Type
Surface Mount
Package / Case
0201 (0603 Metric)
Clamping Voltage
12 V
Operating Voltage
5 V
Breakdown Voltage
5.8 V
Termination Style
SMD/SMT
Peak Surge Current
1 A
Capacitance
0.6 Pf
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Dimensions
0.3 mm W x 0.6 mm L x 0.3 mm H
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ESD11N5.0ST5G
Manufacturer:
ON
Quantity:
25 000
Company:
Part Number:
ESD11N5.0ST5G
Quantity:
500
ESD11N5.0ST5G
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, it is suited for use in high frequency designs such as USB
2.0 high speed and antenna line applications.
Specification Features
Mechanical Characteristics
MOUNTING POSITION:
QUALIFIED MAX REFLOW TEMPERATURE:
Device Meets MSL 1 Requirements
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2010
October, 2010 − Rev. 4
MAXIMUM RATINGS
IEC 61000−4−2 (ESD)
Total Power Dissipation on FR−5 Board
(Note 1) @ T
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
The ESD11N is designed to protect voltage sensitive components
Compliant
Low Capacitance 0.6 pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.60 mm x 0.30 mm
Low Body Height: 0.3 mm
Stand−off Voltage: 5.0 V
Low Leakage
Response Time is < 1 ns
IEC61000−4−2 Level 4 ESD Protection
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
A
= 25°C
Rating
Any
Contact
Air
Symbol
T
°P
R
J
, T
T
qJA
D
L
stg
°
260°C
−40 to +125
Value
±8.0
±15
250
400
260
1
°C/W
Unit
mW
kV
°C
°C
†For information on tape and reel specifications,
ESD11N5.0ST5G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
CASE 152AA
ORDERING INFORMATION
XXXX
YYY
DSN2
http://onsemi.com
= Specific Device Code
= Year Code
(Pb−Free)
Package
DSN2
Publication Order Number:
5000/Tape & Reel
MARKING
DIAGRAM
PIN 1
ESD11N5.0S/D
Shipping
XXXX
YYY

Related parts for ESD11N5.0ST5G

ESD11N5.0ST5G Summary of contents

Page 1

... FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2010 October, 2010 − Rev. 4 ESD11N5.0ST5G 260°C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 2

... T *See Application Note AND8308/D for detailed explanations of datasheet parameters. ELECTRICAL CHARACTERISTICS Device Marking Device ESD11N5.0ST5G N5S0 measured with a pulse test current Surge current waveforms per Figure 5. 4. For test procedure see Figures 3 and 4 and Application Note AND8307/D. Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000− ...

Page 3

... ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes ...

Page 4

The following is taken from Application Note AND8398/D − Board Level Application Note for 0201 DSN2 Package. Printed Circuit Board Solder Pad Design Based on results of board mount testing, ON Semiconductor’s recommended mounting pads and solder mask opening are ...

Page 5

... PCB circuit trace, will reduce the solder thickness and in turn prevent the solder from forming a ball on the PCB pad. This was observed during ON Semiconductor board mounting evaluations. The best results to prevent tilting used a PCB circuit trace equal to the width of the mounting pad ...

Page 6

... DIMENSIONS: MILLIMETERS See Application Note AND8398/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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