02181.25HXP Littelfuse Inc, 02181.25HXP Datasheet - Page 3

• Manufacturer Part Number: 02181.25HXP
• Description: FUSE 250V IEC SLO-BLO 5X20 1.25A
• Manufacturer: Littelfuse Inc
• Series: 218Pr
• Type: Cartridge Fusesr

Specifications of 02181.25HXP

• Fuse Type: Slow Blow, Time Lag
• Voltage - Rated: 250VAC
• Current: 1.25A
• Package / Case: Cylindrical, 5x20mm
• Size / Dimension: 0.197" Dia x 0.787" L (5.00mm x 20.00mm)
• Mounting Type: Holder
• Operating Temperature: -55°C ~ 125°C
• Dc Cold Resistance: 0.446 Ohm
• Melting I²t: 12.65
• Current Rating: 1.25 Amps
• Voltage Rating: 250 Volts
• Fuse Size / Group: 5 mm x 20 mm
• Termination Style: Cartridge
• Body Material: Glass
• Dimensions: 20 mm L x 5.2 mm W
• Product: Axial Lead and Cartridge Fuses
• Interrupt Rating: 35 Amps at 250 VoltsAC
• Mounting Style: Clip
• Operating Temperature Range: - 55 C to + 125 C
• Resistance: 42 mOhms
• Brand/series: 218P Series
• Class: Supplemental
• Current, Rating: 1.25 A
• Material, Body: Glass
• Primary Type: Cylinder
• Resistance, Dc: 0.045 Ohms
• Termination: Cartridge
• Voltage, Rating: 250 VAC
• Voltage Rating Vac: 250V
• Fuse Current: 1.25A
• Breaking Capacity: 35A @ 250VAC
• Fuse Size Metric: 5mm X 20mm
• Blow Characteristic: Slow Blow
• Diameter: 5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Color: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 2181.25P; 2181.25XP; F2429

© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/218.html for current information.
Material
Terminal Strength
Solderability
Product Marking
Packaging
Soldering Parameters - Wave Soldering
Product Characteristics
300
280
260
240
220
200
180
160
140
120
100
Time (Seconds)
80
60
40
20
0
Preheat Time
Body: Glass
Cap: Nickel–plated brass
Leads: Tin–plated Copper
Condition A
Reference IEC 60127 Second
Edition 2003-01 Annex A
Cap1: Brand logo, current and
reel)
Dwell Time
Axial Lead & Cartridge Fuses
5×20 mm > Time-Lag > 218 Series
Cooling Time
Revised: February 19, 2009
271
Recommended Process Parameters:
Recommended Hand-Solder Parameters:
Note: These devices are not recommended for IR or
Convection Reflow process.
Preheat:
Solder Pot Temperature:
Solder Dwell Time:
Operating Temperature
Thermal Shock
Vibration
Humidity
Salt Spray
Temperature Minimum:
Temperature Maximum:
Wave Parameter
–55ºC to +125ºC
Condition B: (5 cycles –65
+125
Condition B
(Typical Industry Recommendation)
100
150
60-180 seconds
260
2-5 seconds
°
Lead-Free Recommendation
C)
°
°
°
C
C
C Maximum
°
C) for 240
°
C to
218 Series