MFU0603FF03000P100 Vishay, MFU0603FF03000P100 Datasheet - Page 3
MFU0603FF03000P100
Manufacturer Part Number
MFU0603FF03000P100
Description
FUSE 3.00A 0603 VFAST SMD
Manufacturer
Vishay
Series
MFUr
Type
Thin Film Chip Fusesr
Datasheet
1.MFU0805FF01000P500.pdf
(13 pages)
Specifications of MFU0603FF03000P100
Fuse Type
Fast Acting
Voltage - Rated
32VDC
Current
3A
Package / Case
0603 (1608 Metric)
Size / Dimension
0.063" L x 0.031" W x 0.018" H (1.60mm x 0.80mm x 0.45mm)
Mounting Type
Surface Mount
Dc Cold Resistance
0.032 Ohm
Melting I²t
0.0227
Current Rating
3 Amps
Voltage Rating
32 Volts
Fuse Size / Group
0603
Termination Style
SMD/SMT
Body Material
Metal Alloy, Ceramic
Dimensions
1.55 mm L x 0.85 mm W
Product
Surface Mount Fuse
Interrupt Rating
50 Amps at 32 VoltsDC
Mounting Style
SMD/SMT
Operating Temperature Range
+ 15 C to + 35 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Color
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MFU06033.00TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MFU0603FF03000P100
Manufacturer:
VISHAY
Quantity:
12 001
DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
Document Number: 28747
Revision: 06-May-10
DIMENSIONS - Chip fuse types, mass and relevant physical dimensions
TYPE
MFU 0402
MFU 0603 0.45 + 0.1/- 0.05
MFU 0805 0.45 + 0.1/- 0.05
MFU 1206
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
MFU 0402
MFU 0603
MFU 0805
MFU 1206
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
0.32 ± 0.07
0.55 ± 0.1
(mm)
H
(mm)
0.55
0.80
1.40
G
-
3.2 + 0.1/- 0.2
1.55 ± 0.05
For technical questions, contact:
1.0 ± 0.05
2.0 ± 0.1
(mm)
(mm)
WAVE SOLDERING
1.10
1.25
1.50
L
Y
-
H
W W
T
1.25 ± 0.15
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.6 ± 0.15
1.10
1.50
1.90
T
Thin Film Chip Fuses
X
2
-
(mm)
W
T
1
Z
(mm)
2.75
3.30
4.40
L
Z
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
-
thinfilm.chipfuse@vishay.com
G
(mm)
W
T
Y
(mm)
0.35
0.65
0.90
1.50
G
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
(mm)
T
1
REFLOW SOLDERING
X
(mm)
0.55
0.70
0.90
1.15
Y
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
0.2 ± 0.1
Vishay Beyschlag
(mm)
T
2
(mm)
0.55
0.95
1.40
1.75
MFU Series
X
www.vishay.com
MASS
(mg)
0.65
1.9
4.7
9.5
(mm)
1.45
2.05
2.70
3.80
Z
3