MFU0805FF04000P500 Vishay, MFU0805FF04000P500 Datasheet - Page 12

FUSE 4.00A 0805 VFAST SMD

MFU0805FF04000P500

Manufacturer Part Number
MFU0805FF04000P500
Description
FUSE 4.00A 0805 VFAST SMD
Manufacturer
Vishay
Series
MFUr
Type
Thin Film Chip Fusesr
Datasheet

Specifications of MFU0805FF04000P500

Fuse Type
Fast Acting
Voltage - Rated
32VDC
Current
4A
Package / Case
0805 (2012 Metric)
Size / Dimension
0.080" L x 0.049" W x 0.018" H (2.00mm x 1.25mm x 0.45mm)
Mounting Type
Surface Mount
Dc Cold Resistance
0.02 Ohm
Melting I²t
0.0403
Current Rating
4 Amps
Voltage Rating
32 Volts
Fuse Size / Group
0805
Termination Style
SMD/SMT
Body Material
Metal Alloy, Ceramic
Dimensions
2 mm L x 1.25 mm W
Product
Surface Mount Fuse
Interrupt Rating
50 Amps at 32 VoltsDC
Mounting Style
SMD/SMT
Operating Temperature Range
+ 15 C to + 35 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Color
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MFU0805FF04000P500
Manufacturer:
VISHAY
Quantity:
60 000
MFU Series
Vishay Beyschlag
www.vishay.com
12
CLAUSE
TEST PROCEDURES AND REQUIREMENTS
9.4
9.5
9.7
-
-
-
-
-
-
-
-
60127-4
IEC
METHOD
78 (Cab)
60068-2
21 (Ue
45 (XA)
45 (XA)
14 (Na)
TEST
6 (Fc)
IEC
-
-
-
-
-
3
)
dissipation acc. to
current- carrying
capacity acc. to
Endurance test
of temperature
temp.-rise and
Rapid change
Verification of
IEC 60127-1
IEC 60127-1
Flammability
temperature
clause 8.2.3
steady state
Damp heat,
Component
of marking
(adhesion)
UL 248-14
resistance
resistance
Maximum
sustained
Fuse-link
Vibration
Solvent
solvent
acc. to
Shear
TEST
For technical questions, contact:
during the final 5 min of
The test is performed
Calculation in accordance with results of clause 9.4 b)
b) I = 1.25 x I
1.0 h on; 0.25 h off;
a) I = 1.0 x I
23 °C; 100 times
I = 1.0 x I
Thin Film Chip Fuses
23 °C; 1 time
clause 9.4 b)
1.0 h on
R
RR 2012M and RR 3216M; 45 N
R
50 °C; method 1, toothbrush
(DC)
R
(DC)
Endurance by sweeping;
(DC)
needle flame test; 10 s
amplitude ≤ 1.5 mm or
(40 ± 2) °C; 56 days;
10 Hz to 2000 Hz;
Isopropyl alcohol;
Isopropyl alcohol;
50 °C; method 2
IEC 60695-2-2,
30 min at UCT;
≤ 200 m/s
30 min at LCT;
UCT = 125 °C;
RR 1608M; 9 N
PROCEDURE
(93 ± 3) % RH
LCT = - 55 °C;
no resonance;
5 cycles
thinfilm.chipfuse@vishay.com
MFU 0402
MFU 0603
MFU 0805
MFU 1206
MFU 0402
MFU 0603
MFU 0805
MFU 1206
MFU 0402
MFU 0603
MFU 0805
MFU 1206
2
; 6 h
I
I
I
I
I
I
I
I
I
R
R
R
R
R
R
R
R
R
I
I
I
R
R
R
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 3.15 A
≤ 5.0 A
≤ 5.0 A
≤ 6.3 A
Temperature rise of terminals
PERMISSIBLE CHANGE
UL 248-14 clause 8.2.4
No burning after 30 s
Dissipation ≤ acc. to
IEC 60127-4 table 2
No visible damage
No visible damage
No visible damage
REQUIREMENTS
no visible damage
Document Number: 28747
Temperature rise
I-t characteristic
Marking legible,
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
of hot spot
acc. to
≤ 85 K
≤ 75 K
Revision: 06-May-10

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