AISC-0603-R0051J-T Abracon Corporation, AISC-0603-R0051J-T Datasheet - Page 4

• Manufacturer Part Number: AISC-0603-R0051J-T
• Description: INDUCTOR WW CERAM 5.1NH 0603
• Manufacturer: Abracon Corporation
• Series: AISC-0603r
• Type: Ceramic Core, Wirewoundr

Specifications of AISC-0603-R0051J-T

• Inductance: 5.1nH
• Tolerance: ±5%
• Package / Case: 0603 (1608 Metric)
• Current: 700mA
• Dc Resistance (dcr): 180 mOhm Max
• Q @ Freq: 18 @ 250MHz
• Self Resonant Freq: 6GHz
• Mounting Type: Surface Mount
• Operating Temperature: -25°C ~ 85°C
• Frequency - Test: 250MHz
• Material - Core: Ceramic
• Applications: Portable Equipment
• Core Material: Ceramic
• Product: Inductors
• Test Frequency: 250 MHz
• Maximum Dc Current: 700 mAmps
• Maximum Dc Resistance: 0.18 Ohms
• Self Resonant Frequency: 6000 MHz
• Q Minimum: 18
• Dimensions: 0.76 mm W x 1.6 mm L x 0.97 mm H
• Operating Temperature Range: - 25 C to + 85 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Shielding: -
• Current - Saturation: -
• Current - Temperature Rise: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 535-10452-2

SMD CERAMIC WIRE-WOUND CHIP INDUCTORS
ATTENTION:
tive Applications. Abracon’s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requir-
ing high reliability where component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme
operating environment, written consent and authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information.
PACKING:
REFLOW PROFILE:
ABRACON IS
ISO9001:2008
CE RTIFIED
T= tape and reel (3,000pcs/reel)
Dimension: mm
AISC-0603-xxx
Embossed Tape
Abracon Corporation’s products are COTS – Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automo-
4.0±0.1
5.0±0.1
3.0±0.1
Top Tape
Embossment
Sprocket Hole
Chip Cavity
1.12±0.05
A
、
1.80±0.05
B
4.0±0.1
10±1.5
P
Φ1.5(+0.1/-0)
A
• 1~2
• Pre-heating: 150~190
• Time above 240
• Peak temperature: 260
• Solder paste: Sn/3.0Ag/0.5Cu
• Max.2 times for re-flowing
0.96±0.05
30332 Esperanza, Rancho Santa Margarita, California 92688
tel [phone]
Visit
K Max
ºC
www.abracon.com
/sec. Ramp
P
4.0±0.1
0.3±0.1
T Max
ºC
: 20~40sec
RoHS
Compliant
2.0±0.1
|
ºC
for Terms & Conditions of Sale
ºC
fax [phone]
/90±30 sec.
Max./10sec.
2.45±0.2
1.80 x 1.12 x 1.02mm
|
www.abracon.com
Revised: 04.08.11
5
0
T
K