LHFP15BB103K Taiyo Yuden, LHFP15BB103K Datasheet - Page 22

• Manufacturer Part Number: LHFP15BB103K
• Description: INDUCTOR 10000UH .25A RADIAL
• Manufacturer: Taiyo Yuden
• Series: LHFP15BBr

Specifications of LHFP15BB103K

• Inductance: 10mH
• Current: 250mA
• Tolerance: ±10%
• Shielding: Shielded
• Dc Resistance (dcr): 6.7 Ohm Max
• Self Resonant Freq: 140kHz
• Package / Case: Radial
• Mounting Type: Through Hole
• Operating Temperature: -25°C ~ 105°C
• Frequency - Test: 1kHz
• Applications: General Purpose
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Q @ Freq: -
• Current - Saturation: -
• Current - Temperature Rise: -

21.Resisitance to soldering
RELIABILITY DATA
heat
Item
LA02 Type/
LA03 Type
No significant abnormality
in appearance
LA04 Type
△L/LD
Within M5L
QD15min.
LA05 Type
LHL□□□/
LHF15BB/
LHFP□□BB
No signifi-
cant abnor-
mality in ap-
pearance
Inductance
changeD
WithinM5L
Q changeD
WithinM30L
Specified Value
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
changeD
WithinM20L
FBA/FBR
△L/LD
WithinM5L
QD30min.
LAV35
Refer to
i n d i v i d u a l
specifica-
tion
FL05□
Type
No signifi-
cant abnor-
mality in ap-
pearance
Impedance
change：
WithinM20L
FL06BT
Type
LAD
Solder temperatureD260M5CfLA02g
DurationD5M0.5 sec. One time
Immersed conditionsDInserted into substrate withｔ= 1.6mm
RecoveryDAt least 1hr of recovery under the standard
LHLYLHFYLHFPD
Solder bath method
Solder temperatureD260M5C
DurationD10M1 sec.
Manual soldering
Solder temperatureD350M10CfAt the tip of soldering irong
DurationD5M1 sec.
CautionDNo excessive pressing shall be applied to terminald
RecoveryD4 to 24hrs of recovery under the standard con-
FBD
Solder bath method
Condition 1
Solder temperatureD260M5C
DurationD10M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
Condition 2
Solder temperatureD350M5C
DurationD3M1 sec.
Immersion depthDUp to 1.5mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
LAV35D
Solder temperatureD260M5C
DurationD5M0.5 sec.
Immersion depthDUp to 2.0 to 2.5mm from botoom of
RecoveryD4 to 24hrs of recovery under the standard con-
FLD
Solder conditionD260M5C 10M1 sec.
Immersion depthDUp to 0.5 to 1.0mm from terminal root.
RecoveryD3hrs of recovery under the standard condition
DUp to 1.5mm from bottom of kinked part.
DUp to 1.5mm from bottom of case.
DUp to 1.5mm from bottom of base.
DUp to 1.5mm from bottom of kinked part.
DUp to 1.5mm from bottom of case.
DUp to 1.5mm from bottom of base.
[LHL06, LHLC06, LHLZ06]
[LHL08, LHL10, LHL13, LHL16]
[LHF15BB, LHFP□□BB]
[LHL06, LHLC06, LHLZ06]
[LHL08, LHL10, LHL13, LHL16]
[LHF15BB, LHFP□□BB]
dition after the tset.
after the test.
dition after the tset.
after the test.
condition after the test, followed by the mea-
surement within 2hrs.
Test Method and Remarks
kinked part.
270M5CfLA03YLA04YLA05g
6/9
347
5