PIC16F722-I/SS Microchip Technology, PIC16F722-I/SS Datasheet - Page 219

• Manufacturer Part Number: PIC16F722-I/SS
• Description: IC PIC MCU FLASH 2KX14 28-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F722-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPAC164307 - MODULE SKT FOR PM3 28SSOP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

23.4
© 2009 Microchip Technology Inc.
D130
D131
D132
D133
D134
D135
D135A
Legend:
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
Param
No.
*
†
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
4: Including OSC2 in CLKOUT mode.
DC Characteristics: PIC16F72X/PIC16LF72X-I/E (Continued)
E
V
I
I
T
T
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
clock in RC mode.
normal operating conditions. Higher leakage current may be measured at different input voltages.
PPPGM
DDPGM
Sym.
PEW
RETD
P
PEW
TBD = To Be Determined
DC CHARACTERISTICS
Program Flash Memory
Cell Endurance
V
Voltage on MCLR/V
Erase/Program
V
V
Current on MCLR/V
Erase/Write
Current on V
Write
Erase/Write cycle time
Characteristic Retention
V
Charging current
Source/sink capability when
charging complete
DD
DD
DD
CAP
for Read
for Bulk Erase
for Write or Row Erase
Capacitor Charging
Characteristic
DD
during Erase/
PP
PP
during
during
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
V
Min.
100
8.0
2.7
2.7
40
—
—
—
—
—
MIN
PIC16F72X/PIC16LF72X
Typ†
200
0.0
1k
—
—
—
—
—
3
-40°C ≤ T
Max.
9.0
5.0
5.0
2.8
—
—
—
—
—
—
—
A
A
≤ +85°C for industrial
≤ +125°C for extended
Units
Year
E/W
mA
mA
mA
ms
μ
V
V
V
V
A
Temperature during programming:
10°C ≤ T
Temperature during programming:
10°C ≤ T
Temperature during programming:
10°C ≤ T
V
V
voltage
Temperature during programming:
10°C ≤ T
Temperature during programming:
10°C ≤ T
Temperature during programming:
10°C ≤ T
Provided no other specifications
are violated
MIN
MAX
= Minimum operating voltage
= Maximum operating
A
A
A
A
A
A
≤ 40°C
≤ 40°C
≤ 40°C
≤ 40°C
≤ 40°C
≤ 40°C
Conditions
DS41341E-page 219