PIC16C56A-20/P Microchip Technology, PIC16C56A-20/P Datasheet - Page 159

• Manufacturer Part Number: PIC16C56A-20/P
• Description: IC MCU OTP 1KX12 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C56A-20/P

• Core Size: 8-Bit
• Program Memory Size: 1.5KB (1K x 12)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 12
• Ram Memory Size: 25Byte
• Cpu Speed: 40MHz
• No. Of Timers: 1
• Digital Ic: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164001 - MODULE SKT PROMATEII 18/28DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

19.1
PIC16C54C/C55A/C56A/C57C/C58B-40
Param
D001
D002
D003
D004
D010
D020
Note 1: Device operation between 20 MHz to 40 MHz requires the following: V
(Commercial)
No.
2002 Microchip Technology Inc.
* These parameters are characterized but not tested.
† Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus load-
only and is not tested.
Symbol
V
S
externally driven, OSC2 pin not connected, HS oscillator mode and commercial temperatures. For operation
between DC and 20 MHz, See Section 19.1.
ing, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current
consumption.
DC Characteristics:PIC16C54C/C55A/C56A/C57C/C58B-40 (Commercial)
V
V
I
I
a)
b)
POR
VDD
DD
PD
DD
DR
The test conditions for all I
For standby current measurements, the conditions are the same, except that the device is in SLEEP
wave, from rail-to-rail; all I/O pins tristated, pulled to V
abled as specified.
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
on Reset
Supply Current
Power-down Current
DD
DD
Start Voltage to ensure
Rise Rate to ensure Power-
Characteristic
(3)
DD
can be lowered in SLEEP mode without losing RAM data.
(3)
DD
measurements in active Operation mode are: OSC1 = external square
(2)
Preliminary
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0.05*
Min
4.5
—
—
—
—
—
—
Typ† Max Units
1.5*
Vss
5.2
6.8
1.8
9.8
—
—
12.3
27*
5.5
7.0
16
—
—
—
SS
, T0CKI = V
V/ms See Section 5.1 for details on
mA
mA
V
V
V
A
A
0 C
DD
HS mode from 20 - 40 MHz
Device in SLEEP mode
See Section 5.1 for details on
Power-on Reset
Power-on Reset
F
F
V
V
OSC
OSC
DD
DD
DD
between 4.5V to 5.5V, OSC1 pin
= 5.5V, WDT disabled, Commercial
= 5.5V, WDT enabled, Commercial
, MCLR = V
T
= 40 MHz, V
= 40 MHz, V
A
PIC16C5X
+70 C for commercial
Conditions
DD
DS30453D-page 157
DD
DD
; WDT enabled/dis-
= 4.5V, HS mode
= 5.5V, HS mode
(1)