PIC16C54-XTI/P Microchip Technology, PIC16C54-XTI/P Datasheet - Page 182

• Manufacturer Part Number: PIC16C54-XTI/P
• Description: IC MCU OTP 512X12 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C54-XTI/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 12
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 6.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164001 - MODULE SKT PROMATEII 18/28DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C5X
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
DS30453D-page 180
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
W2
n
E1
W1
eB
E
Dimension Limits
§
2
1
Units
W2
eB
W1
D
A2
A1
E1
B1
D
n
p
A
E
L
c
B
c
A1
A
MIN
Preliminary
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.060
.425
.150
.210
.012
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
22.86
A2
2.54
4.64
4.06
0.57
7.94
7.37
3.49
0.25
1.40
0.47
9.78
3.56
5.08
18
L
MAX
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81