PIC18LF25J50-I/SP Microchip Technology, PIC18LF25J50-I/SP Datasheet - Page 15

IC PIC MCU FLASH 32K 2V 28-DIP

PIC18LF25J50-I/SP

Manufacturer Part Number
PIC18LF25J50-I/SP
Description
IC PIC MCU FLASH 32K 2V 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18LF25J50-I/SP

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
16
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
31 KHz
Number Of Programmable I/os
16
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180024
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F2XJXX/4XJXX FAMILY
3.3
Endurance and Retention
To maintain the endurance specification of the Flash
program memory cells, each byte should never be pro-
grammed more than once between erase operations.
Before attempting to modify the contents of a specific
byte of Flash memory a second time, an erase operation
(either a Bulk Erase or a Row Erase which includes that
byte) should be performed.
© 2009 Microchip Technology Inc.
DS39687E-page 15

Related parts for PIC18LF25J50-I/SP