PIC16C63A-04/SO Microchip Technology, PIC16C63A-04/SO Datasheet - Page 2

• Manufacturer Part Number: PIC16C63A-04/SO
• Description: IC MCU OTP 4KX14 PWM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C63A-04/SO

• Program Memory Type: OTP
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Data Rom Size: 192 B
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3.65 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16C63A
2.
Figure 2:
DS80015B-page 2
Note 1: For T
INSTRUCTION FLOW
Instruction
fetched
Instruction
executed
CLKOUT
Module: OSCILLATOR
The Oscillator Start-up Timer (T
occur when the device wakes-up from sleep.
Figure 2 shows the start-up of the crystal after the
event that causes the device to wake up from sleep
mode (as specified in device data sheet). The start-
up time (T
The events that wake-up the device from sleep are:
• An interrupt
• A WDT overflow (wake-up)
• A Brown-out Reset
• A MCLR reset
In applications where time based measurements are
started immediately after wake-up from sleep, the
suggested work around should be implemented.
Work Around
After the SLEEP instruction, do a software delay of
256 T
Interrupt vector addresses, test to see if the device
woke from sleep (the TO and PD bits), and if the
device did wake from sleep, ensure that the total
cycle delay is 256 T
2: T
3: CLKOUT is not available in these osc modes, but shown here for timing reference.
OSC1
PC
(4)
CY
OST
Wake-up from Sleep
Inst(PC) = SLEEP
Q1 Q2 Q3 Q4
(same as 1024 T
OST
OST
= 1024T
Inst(PC - 1)
) may not occur.
PC
delay to be enabled, the XT, HS or LP oscillator mode must be selected.
OSC
CY
, This delay may not occur, and every valid clock edge will generate internal device clocks.
.
Q1 Q2 Q3 Q4
Inst(PC + 1)
SLEEP
PC+1
OSC
). At the Reset and
OST
) delay may not
Q1
—
Wake-up Event Occurs
T
OST
(2)
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
T
CY
T
CY
Q1 Q2 Q3 Q4
1999 Microchip Technology Inc.
T
CY
Q1 Q2 Q3 Q4
T
CY