PIC16C55-HSI/P Microchip Technology, PIC16C55-HSI/P Datasheet - Page 176

• Manufacturer Part Number: PIC16C55-HSI/P
• Description: IC MCU OTP 512X12 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-HSI/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 20
• Ram Memory Size: 24Byte
• Cpu Speed: 40MHz
• No. Of Timers: 1
• Digital Ic Case Style: DIP
• Core: PIC
• Processor Series: PIC16C
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 24 B
• Data Rom Size: 512 B
• Number Of Programmable I/os: 20
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 6.25 V
• Mounting Style: Through Hole
• Height: 4.95 mm
• Length: 39.75 mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Width: 14.73 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28XP - SOCKET TRANSITION ICE 28DIPAC164001 - MODULE SKT PROMATEII 18/28DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C55-HSI/PR; PIC16C55-HSI/PR

PIC16C5X
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS30453D-page 174
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.135
.325
.295
.135
.015
.065
.160
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
2002 Microchip Technology Inc.
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15