DSPIC33FJ128GP202-I/SP Microchip Technology, DSPIC33FJ128GP202-I/SP Datasheet - Page 382

• Manufacturer Part Number: DSPIC33FJ128GP202-I/SP
• Description: IC DSPIC MCU/DSP 128K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP202-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Package: 28SPDIP
• Device Core: dsPIC
• Family Name: dsPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Interface Type: I2C/SPI/UART
• On-chip Adc: 10-chx10-bit|10-chx12-bit
• On-chip Dac: 2-chx16-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA330019 - PIM DSPIC33F MC 44P-100P QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DS70292D-page 382
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
Preliminary
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
2
1
0.80
0.00
6.30
6.30
0.25
0.30
0.20
MIN
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
 2009 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
K
e
b