PIC18F2525-I/SO Microchip Technology, PIC18F2525-I/SO Datasheet - Page 25

• Manufacturer Part Number: PIC18F2525-I/SO
• Description: IC MCU FLASH 24KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2525-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 48KB (24K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3986 B
• Interface Type: SPI, I2C, EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18F4620 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
2.1
PIC18F2525/2620/4525/4620 devices can be operated
in ten different oscillator modes. The user can program
the configuration bits, FOSC3:FOSC0, in Configuration
Register 1H to select one of these ten modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
2.2
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
 2004 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL High-Speed Crystal/Resonator
RC
RCIO
INTIO1 Internal Oscillator with F
INTIO2 Internal Oscillator with I/O on RA6
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s
specifications.
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
with PLL enabled
External Resistor/Capacitor with
F
External Resistor/Capacitor with I/O
on RA6
on RA6 and I/O on RA7
and RA7
External Clock with F
External Clock with I/O on RA6
OSC
/4 output on RA6
OSC
OSC
/4 output
/4 output
PIC18F2525/2620/4525/4620
Preliminary
FIGURE 2-1:
TABLE 2-1:
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following Table 2-2 for additional
information.
Note 1: See Table 2-1 and Table 2-2 for initial values of
DD
Mode
XT
and temperature range for the application.
C1
C2
2: A series resistor (R
3: R
(1)
(1)
Typical Capacitor Values Used:
C1 and C2.
strip cut crystals.
F
3.58 MHz
4.19 MHz
XTAL
R
varies with the oscillator mode chosen.
4 MHz
4 MHz
S
Freq
(2)
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
S
OSC1
) may be required for AT
15 pF
15 pF
30 pF
50 pF
R
F
(3)
DS39626B-page 23
PIC18FXXXX
Sleep
To
OSC2
Internal
Logic
15 pF
15 pF
30 pF
50 pF